共栄電資 Product Lineup

We have substrate-mounted busbars and coils used for high current applications in the heavy electrical and automotive industries. By substrate mounting, the following effects can be expected: - Substrate mounting of power devices such as IGBTs and SiCs - Installation on equipment after substrate mounting → Reduction of assembly work and prevention of miswiring - Space-saving due to substrate mounting and simplification of wiring → Miniaturization of the entire device - Generally, a thick copper substrate refers to a substrate with a copper foil thickness of 200μ (0.2mm) or more, but we have also achieved substrate mounting with 3000μ (3mm) copper plates. - The greatest advantage of substrate mounting is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, so there is no concern about variation in thickness like with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and a compact, lightweight design. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization offers the following benefits: - Mounting of power devices such as IGBTs and SiCs on the substrate. - After substrate mounting, installation into equipment is possible, leading to reduced assembly time and prevention of miswiring. - Space-saving due to simplified substrate and wiring, resulting in overall equipment miniaturization. - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, the substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to devices after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplified substrate and wiring → Overall miniaturization of the device - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those found in powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be done safely. *For more details, please refer to the PDF document or feel free to contact us.

We have substrate-formed busbars used for high current applications. By utilizing our special technology for substrate formation, we achieve high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, substrate formation is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to equipment after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Miniaturization of the entire device - The greatest advantage of substrate formation is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - Covering areas other than the necessary parts with a substrate makes handling easier and allows for safe operations during transport and installation. *For more details, please refer to the PDF document or feel free to contact us.

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and miniaturization. We can accommodate lengths of up to 1,000mm. Additionally, the substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to devices after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Overall miniaturization of the device - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and operations during transport and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

We have substrate-ized busbars used for high current applications. Our special technology enables substrate-ization, achieving high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to equipment after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Overall miniaturization of the equipment - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - Covering areas other than the necessary parts with a substrate makes handling easier and allows for safe operations during transportation and installation. *For more details, please refer to the PDF document or feel free to contact us.

In data center power supply systems, stable power supply and space-saving are required. Especially as density increases, improving power supply efficiency and addressing heat generation are crucial. The reliability of busbars is directly linked to the stable operation of the system, making high insulation and secure connections essential. Our busbars (bus bars) for high current substrates address these challenges. 【Usage Scenarios】 - Power units for data centers - Power supply within server racks - Power systems requiring high-density mounting 【Benefits of Implementation】 - Improved safety due to high insulation - Enhanced system efficiency through space-saving - Reduced assembly labor and prevention of wiring errors - Miniaturization of the entire device