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  3. 共栄電資
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Electronic Components and Semiconductors
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共栄電資

EstablishmentAugust 14, 1958
capital9800Ten thousand
number of employees84
addressTokyo/Shinjuku-ku/14 Baba Shimomachi
phone03-3207-7111
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last updated:Sep 16, 2022
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共栄電資 List of Products and Services

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Aluminum base substrate Aluminum base substrate
Thick copper Thick copper
GE Products GE Products
Composite substrate Composite substrate
Large high-multilayer substrate Large high-multilayer substrate
Thick

Thick copper

We have substrate-processed busbars and thick copper coils used for high current applications.

Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm]

By substrate-izing busbars and coils used for high current applications, high insulation properties and a reduction in labor hours are achieved!

We have substrate-mounted busbars and coils used for high current applications in the heavy electrical and automotive industries. By substrate mounting, the following effects can be expected: - Substrate mounting of power devices such as IGBTs and SiCs - Installation on equipment after substrate mounting → Reduction of assembly work and prevention of miswiring - Space-saving due to substrate mounting and simplification of wiring → Miniaturization of the entire device - Generally, a thick copper substrate refers to a substrate with a copper foil thickness of 200μ (0.2mm) or more, but we have also achieved substrate mounting with 3000μ (3mm) copper plates. - The greatest advantage of substrate mounting is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, so there is no concern about variation in thickness like with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

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Bus bar (bus bar) high current substrate

By substrate-izing the busbar, high insulation and compactness are achieved!

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and a compact, lightweight design. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization offers the following benefits: - Mounting of power devices such as IGBTs and SiCs on the substrate. - After substrate mounting, installation into equipment is possible, leading to reduced assembly time and prevention of miswiring. - Space-saving due to simplified substrate and wiring, resulting in overall equipment miniaturization. - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

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[Concerns about Busbars] Busbars are difficult to handle.

By converting the busbar into a circuit board, high insulation and compactness are achieved!

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, the substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to devices after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplified substrate and wiring → Overall miniaturization of the device - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those found in powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be done safely. *For more details, please refer to the PDF document or feel free to contact us.

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[Busbar Concerns] I want to reduce the labor hours during assembly.

By converting the busbar into a circuit board, high insulation and compactness are achieved!

We have substrate-formed busbars used for high current applications. By utilizing our special technology for substrate formation, we achieve high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, substrate formation is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to equipment after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Miniaturization of the entire device - The greatest advantage of substrate formation is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - Covering areas other than the necessary parts with a substrate makes handling easier and allows for safe operations during transport and installation. *For more details, please refer to the PDF document or feel free to contact us.

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[Busbar Concerns] I want to ensure the safety of workers in high current equipment.

By converting the busbar into a substrate, high insulation and miniaturization are achieved!

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and miniaturization. We can accommodate lengths of up to 1,000mm. Additionally, the substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to devices after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Overall miniaturization of the device - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and operations during transport and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

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[Concerns about Busbars] The busbar takes up space, so the equipment cannot be miniaturized.

By integrating the busbar into a circuit board, high insulation properties and miniaturization are achieved!

We have substrate-ized busbars used for high current applications. Our special technology enables substrate-ization, achieving high insulation properties and compactness. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization is expected to provide the following benefits: - Substrate mounting of power devices such as IGBTs and SiCs - Possible attachment to equipment after substrate mounting → Reduction of assembly labor and prevention of miswiring - Space-saving due to simplification of substrate and wiring → Overall miniaturization of the equipment - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - Covering areas other than the necessary parts with a substrate makes handling easier and allows for safe operations during transportation and installation. *For more details, please refer to the PDF document or feel free to contact us.

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