ワンダーフューチャーコーポレーション Product Lineup

"IH Reflow" is a mounting technology that applies IH (induction heating), enabling instant, non-contact mounting of only the necessary parts without physical stress, allowing for damage-free implementation. This technology makes it possible to mount electronic components that are not heat-resistant on low-heat-resistance substrates such as inexpensive, flexible, and stretchable PET, paper, and fabric. Additionally, by applying this technology, it can replace the conventional mounting processes on high-heat-dissipation substrates that typically use lasers or manual soldering, dramatically improving production throughput. Sales of IH Reflow devices, bonding experiments, prototype contracting, and unique contract mounting services based on the core technology "IH Reflow" are also available. 【Features】 - Damage-free component mounting technology for low-heat-resistance and high-heat-dissipation substrates - Heating and mounting using electromagnetic induction - Achieves instant, damage-free, non-contact mounting at specific locations with a yield of 100% - Heating method: Induction heating only at the mounting points (single point to multiple points) - Capable of mounting on low-heat-resistance substrates and high-heat-dissipation boards *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract

The "N-TKG TALL" is an IH (Induction Heating) spot reflow system that can heat only the metal parts using the principle of electromagnetic induction. It allows soldering on non-heat-resistant materials such as PET, PBT, fabric, and 3D MID. Additionally, you can choose either a head for FPCB bonding or for component bonding when placing an order. 【Features】 ■ Spot heating is possible for soldering on 3D shapes and curved surfaces. ■ Soldering on high heat-dissipation substrates is possible. ■ Achieves energy savings and space efficiency. ■ Can use standard solder. ■ Applicable to heat-curing resins and other materials besides solder. *For more details, please download the PDF or feel free to contact us.

• Reflow Equipment

Wonder Future Corporation is a research and development company established in April 2013 by engineers specializing in technologies such as LCD displays, touch panels, and semiconductors, focusing on the development of electronic devices. This document provides a detailed introduction to the features and benefits of our IH spot joining technology, which employs electromagnetic induction for heating, as well as the principles of heating. [Contents (excerpt)] ■ Principle of IH heating ■ Application fields of IH spot reflow business ■ Development of electromagnetic induction heating technology ■ Advantages of IH spot reflow technology, among others *For more details, please refer to the PDF document or feel free to contact us.

• Heating device

We provide solutions for 3D resin touch panels. We contribute to the realization of products through technical and know-how support to the touch panel manufacturers specified by our customers, as well as through patent licensing. Please feel free to contact us if you have any requests. 【Product Types】 ■ OTP (Outer Touch Panel) Integrated touch panel module ■ CLAO (Cover Lens All in One) Integrated cover lens touch panel ■ OTP-β Touch panel module with CLAO and frame molded as one *For more details, please download the PDF or feel free to contact us.

• Plastic utensils and containers
• Touch Panel