島田電子工業 List of Products and Services

This is a series of ultra-thin light-emitting devices that are among the thinnest in the industry. It features three main characteristics, achieving high quality, durability, and reliability. 1. High durability achieved with a palladium-plated frame. Typically, products are plated after completion, but post-completion plating can lead to quality issues due to the intrusion of plating solution. Our products use pre-plating, eliminating this risk. 2. No quality degradation due to material oxidation with low-temperature assembly. Low-temperature rapid curing die bonding ensures high adhesion between the chip, frame, and resin. Additionally, high bonding quality is achieved by preventing frame oxidation and reducing impurities, eliminating quality degradation due to material oxidation. 3. Adoption of highly reliable resin/structure. High-reliability molded resin, void-free molding under reduced pressure, and a double-structured package prevent quality degradation. 4. Stable operation even in high current regions due to the use of epitaxial wafers. The adoption of epitaxial wafers results in a Vce(sat) that is approximately 40% lower compared to competitors, ensuring stable operation even in stepped current regions. *If you have any concerns, please feel free to contact us.

• Other electronic parts

This is a series of ultra-thin light-emitting devices that are among the thinnest in the industry. It features three main characteristics, achieving high quality, durability, and reliability. 1. Use of a palladium-plated frame for high durability Typically, solder plating is done after the product is completed, but post-plating can lead to the intrusion of plating solution, resulting in quality issues. Our products use pre-plating, eliminating this risk. 2. Low-temperature assembly prevents quality degradation due to material oxidation By utilizing low-temperature rapid curing die bonding, we achieve high adhesion between the chip, frame, and resin. Additionally, the high bonding quality due to oxidation prevention of the frame and reduction of impurities ensures no quality degradation from material oxidation. 3. Adoption of highly reliable resin/structure We prevent quality degradation with highly reliable molded resin, void-free molding under reduced pressure, and a double-structured package that prevents deterioration. *If you have any concerns, please feel free to contact us.

• Lamps and light emitting devices

By monitoring the lighting status of the stacked signal lights, this system enables real-time visualization of equipment operating conditions. ◆ Just overlay it on existing stacked signal lights! It automatically acquires signals and communicates wirelessly, allowing for the visualization of equipment operating conditions. We provide a seamless solution from sensing devices to system visualization, making it easy for anyone to get started right away.

• Other operation management software