エイ・エス・ディ Product Lineup

Waste, including organic waste and sludge, must be converted into resources and effectively utilized, rather than being discarded, landfilled, or incinerated, to ensure the preservation and maintenance of the global environment. In our "Environmental Business," we possess technologies such as sorting technology, drying technology, carbonization technology, fermentation technology, and dewatering technology. Through the development of devices and systems for the reuse of waste, we aim to assist in the establishment of a circular society and support environmental activities. 【Technologies】 ■ Sorting technology ■ Drying technology ■ Carbonization technology ■ Fermentation technology ■ Dewatering technology *For more details, please refer to the PDF materials or feel free to contact us.

• Drying Equipment
• Other environmental equipment

This document introduces the "Powder Sputtering Technology" handled by A.S.D. Corporation. It includes comparisons between plating (wet method) and sputtering (dry method) in powder coating, as well as examples of film formation (optical microscope observation images) and exterior diagrams of powder sputtering equipment. [Contents] ■ Comparison between plating (wet method) and sputtering (dry method) in powder coating ■ Expansion of applicability ■ Exterior diagram of powder sputtering equipment ■ Examples of film formation - Optical microscope observation images - Cross-sectional SEM observation images ■ Specifications of demo experimental equipment *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment

The "Powder Sputtering Device" is a machine that coats thin films on the surface of powders with a diameter of a few micrometers using vacuum and plasma. It has a stirring mechanism based on a barrel swing motion, allowing for film formation using RF or DC sputtering methods. Applications are expected in preventing the deterioration of powder materials, controlling the electrical conductivity of powder surfaces, and resource conservation through thin film formation of rare materials. 【Features】 ■ Uniform film formation with the stirring mechanism ■ No chemical reactions required ■ High purity and strong adhesion of the film *For more details, please download the PDF or feel free to contact us.

• Sputtering Equipment