We also support contract film formation and on-site experiments based on customer-requested samples!
The "Powder Sputtering Device" is a machine that coats thin films on the surface of powders with a diameter of a few micrometers using vacuum and plasma. It has a stirring mechanism based on a barrel swing motion, allowing for film formation using RF or DC sputtering methods. Applications are expected in preventing the deterioration of powder materials, controlling the electrical conductivity of powder surfaces, and resource conservation through thin film formation of rare materials. 【Features】 ■ Uniform film formation with the stirring mechanism ■ No chemical reactions required ■ High purity and strong adhesion of the film *For more details, please download the PDF or feel free to contact us.
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basic information
【Application Examples】 ■ Improvement of characteristics of secondary battery electrode materials ■ Effective utilization of rare metals (reduction of platinum usage in catalytic applications) ■ Surface modification of powders (control of conductivity and wettability) ■ Protection of powders (prevention of oxidation and wear resistance) *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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Our company is engaged in the vacuum business and the environmental business. In the vacuum business, we have inherited the business from Kyoritsu Co., Ltd., and we are involved in contract film deposition using powder sputtering equipment as well as the manufacturing and sales of the equipment. In the environmental business, we plan and sell recycling systems focused on sorting and drying systems. Please feel free to contact us if you have any inquiries.
