ピンク・ジャパン List of Products and Services

This is an introduction to a booklet that explains the plasma surface treatment equipment and the principles of plasma handled by Pink Japan. Matter changes its state depending on temperature. The commonly known states of matter are solid, liquid, and gas. However, there is a state that follows these, which is "plasma"! Plasma is a state where gas is ionized and is also referred to as the "fourth state." The difference between gas and plasma is high electrical conductivity and chemical reactivity. Examples of plasma found in nature include lightning, auroras, and the sun. In everyday life, the principles of plasma are also used in fluorescent lights, energy-saving lamps, and televisions. [Contents of the Technical Booklet (Excerpt)] ◆ What is Vacuum Plasma Treatment? ◆ Surface Treatment, Etching, Coating ◆ Applications of Standard and Custom Equipment *We are offering a booklet that explains plasma. Please download the PDF to view it. Feel free to contact us for detailed specifications of plasma surface treatment equipment.

• Plasma surface treatment equipment

This document provides a detailed introduction to "soldering technology." It includes topics such as "vacuum soldering," "vacuum reflow systems," "system overview," and "transport systems." Our vacuum reflow system offers void-free solder connections using preforms and/or solder paste in continuous processes for large power modules and similar applications. [Contents (excerpt)] ■ Vacuum technology and product development as core technology ■ Vacuum soldering ■ Vacuum reflow systems ■ System overview ■ Transport systems *For more details, please refer to the PDF document or feel free to contact us.

• Vacuum Equipment

This document provides detailed information about "Plasma Technology." It includes topics such as "What is Vacuum Plasma," "Surface Activation by Vacuum Plasma," and "Advanced Surface Cleaning." Our company offers high-quality customized vacuum plasma equipment that can accommodate various sizes with different configurations. [Contents] ■ Plasma Technology ■ What is Vacuum Plasma Treatment ■ Surface Activation/Surface Modification (Simultaneous Processing, Individual Processing) ■ Advanced Surface Cleaning ■ Etching *For more details, please refer to the PDF document or feel free to contact us.

• Other surface treatment equipment

In the heating process, the effectiveness of vacuum drying has been proven in various fields. In vacuum drying, the total pressure of the drying system is reduced so that moisture or solvents transition from liquid to vapor at already low temperatures. By precisely applying heat and adjusting pressure, the drying process can be optimized. Typically, a vacuum drying system consists of a drying oven equipped with a heating system, a vacuum pump unit for special drying processes, and a control system. 【Product Lineup】 ■ Vacuum Drying System "VSD" ■ Vacuum Drying Furnace with Isolator "VSDI" ■ Vacuum Drying System with Isolator/Isolator and Pressure Nutsche "VSDIN" ■ Vacuum Drying System "VSD-e" ■ Vacuum Drying System "VT" *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

• Drying Equipment

The "V6-G" is a vacuum plasma surface treatment device capable of supporting a wide manufacturing range from small-scale production to research and development. The device can be used for surface treatment, advanced cleaning, and activation. The built-in dedicated control PLC can save each process and parameter that can be freely set. 【Features】 ■ High-performance tabletop system ■ Capable of supporting a wide manufacturing range from small-scale production to research and development ■ The device can be used for surface treatment, advanced cleaning, and activation ■ The built-in dedicated control PLC can save each process and parameter that can be freely set ■ Easy operation with a touch screen and clear instruction display *For more details, please refer to the PDF materials or feel free to contact us.

• Plasma surface treatment equipment

The sintering system "SIN200+" is a new bonding technology that replaces conventional Sn-based solder materials, capable of supporting applications from R&D prototype evaluation to mass production for die attach bonding through sintering of power semiconductor modules. It is particularly optimal for SiC power semiconductors. During the entire process of heating, sintering (pressurizing), and cooling within a vacuum chamber, the substrate temperature, ambient pressure, and process gas can be accurately controlled in real-time, and reduction using formic acid gas is also possible. Compared to traditional bonding under atmospheric pressure, the process, which varies pressure, pressurization, and gas injection in a timely manner, achieves a more uniform and highly reliable sintering bond. Additionally, the sintering materials can accommodate silver paste and copper paste, and a special pressurizing jig is employed, eliminating the need to change jigs even when the bonding height or size changes, thus providing rapid, flexible, and economical processing for a variety of products. There are already numerous delivery records to major power semiconductor manufacturers in Europe. *For more details, please refer to the PDF materials or feel free to contact us.*

• Other processing machines
• Other mounting machines
• Other semiconductor manufacturing equipment

The "VADU series" is a vacuum reflow system equipped with a soldering zone featuring a vacuum chamber and a cooling zone. It allows for reduction using formic gas and is compatible with flux-containing solder paste and preforms. The configuration of the equipment can be selected according to the application, product size, and production scale. ■ VADU100 is a system suitable for small-scale production and research applications in laboratories. ■ VADU200 is a batch-type mass production device capable of processing 300mm wafers. ■ VADU300 is an inline device that can accommodate large-scale mass production. Additionally, various custom modifications can be made based on product and process conditions. 【Features】 ■ Void-free solder connections ■ Compatible with preforms and solder paste ■ Flux management (separation and recovery function) ■ Reduction using formic gas is possible ■ Independent soldering profiles ■ Soldering temperatures up to 400°C (up to 500°C as an option) ■ Auto-clamp mechanism (automatic product holding function) ■ Control of heating rates and cooling rates *For more details, please download the PDF or feel free to contact us.

• Other processing machines
• Soldering Equipment