Flexible Sintering System 'SIN200+'

Next-generation power semiconductor module sintering (sintering) prototype and mass production equipment.

The sintering system "SIN200+" is a new bonding technology that replaces conventional Sn-based solder materials, capable of supporting applications from R&D prototype evaluation to mass production for die attach bonding through sintering of power semiconductor modules. It is particularly optimal for SiC power semiconductors. During the entire process of heating, sintering (pressurizing), and cooling within a vacuum chamber, the substrate temperature, ambient pressure, and process gas can be accurately controlled in real-time, and reduction using formic acid gas is also possible. Compared to traditional bonding under atmospheric pressure, the process, which varies pressure, pressurization, and gas injection in a timely manner, achieves a more uniform and highly reliable sintering bond. Additionally, the sintering materials can accommodate silver paste and copper paste, and a special pressurizing jig is employed, eliminating the need to change jigs even when the bonding height or size changes, thus providing rapid, flexible, and economical processing for a variety of products. There are already numerous delivery records to major power semiconductor manufacturers in Europe. *For more details, please refer to the PDF materials or feel free to contact us.*

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