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"Micron-sized diamond powder" is an abrasive with different shapes, including blocky, irregular, and uncrushed particles. Thanks to our unique classification technology, we precisely remove coarse particles that cause roughness on the processing surface and fine particles that lead to agglomeration, all within the particle size distribution of micron-sized diamond abrasives. We offer a wide range of products, including the standard "TMD," which is suitable for applications requiring processing surface precision, and the "TMD-L," which focuses on crush resistance. [TMD/TMD-S Features] - Standard abrasive - Widely used for lapping, polishing, and slicing of hard materials such as carbide, sapphire, and ceramics - Classified products are precision abrasives that have undergone primary, secondary, and tertiary classification of TMD abrasives at our facility - Suitable for applications requiring processing surface precision *For more details, please refer to the PDF document or feel free to contact us.

Our company offers a variety of 'CBN powders (cubic boron nitride)' in different strengths and shapes. We have options compatible with bonding materials such as resin, vitrified, and metal, as well as a wide range of abrasive grains for electroplated tools, allowing for selection based on grinding efficiency, strength, thermal stability, toughness, and other needs. You can choose from two shapes: blocky and irregular. We can also accommodate inquiries regarding costs and requests for nickel and titanium coatings. 【Product Lineup (excerpt)】 ■ CBN-880… Single crystal, black, blocky shape, medium abrasive toughness, excellent thermal stability. ■ CBN-950… Golden abrasive grains, blocky shape, particularly strong and thermally stable, suitable for electroplated tools and metal bond applications. ■ CBN-980… Dark brown abrasive grains, irregular shape, sharp, high strength, and excellent thermal stability. ■ CBN-M850… Micron-sized CBN abrasive grains, black, mainly suitable for polishing and grinding. *You can view a comparison chart of physical properties in the PDF download. Please feel free to contact us with any inquiries.

TMD-PC10 is an abrasive formed into a spherical aggregate of single crystal diamond using special technology. It can maintain micron edges during work and reduce processing scratches. It is suitable as an alternative to polycrystalline diamond powder and polycrystalline-like diamond powder. ■ Features * Spherical diamond powder made of single crystal aggregates * Original abrasive structure that improves the finishing surface * Original abrasive structure that achieves high polishing efficiency * Feel free to download the PDF or contact us for inquiries.

■ Polycrystalline-like diamond powder ■ It has natural fracturing properties, continuously generating new edges ■ A reduction in scratches on the polished or ground objects can be expected

The "TMD-PC10" is a single crystal diamond powder formed into a spherical aggregate using special technology, consisting of single crystal aggregates of spherical diamond powder. It is suitable as an alternative to polycrystalline diamond powder and polycrystalline-like diamond powder. It can maintain micron edges during work and reduce processing scratches. 【Features】 ■ Improves the finish surface ■ Achieves high polishing efficiency ■ Capable of reducing processing scratches ■ Original abrasive grain structure *For more details, please download the PDF or feel free to contact us.

In the precision grinding industry, there is a demand for high precision in the grinding process to improve product quality and durability. Particularly in the grinding of hard materials such as sapphire, SiC, and ceramics, surface smoothness and shape accuracy are crucial factors that influence product performance. Conventional grinding methods often lead to scratches and uneven polishing, making it difficult to achieve high precision finishes. TMD-PL polycrystalline-like diamond powder generates new edges continuously due to its self-fracturing properties, enabling high-precision grinding with minimal scratches. [Application Scenarios] - Precision grinding of sapphire, SiC, ceramics, etc. - Application in diamond slurries [Effects of Implementation] - Improved grinding quality due to reduced scratches - Shortened grinding time - Increased product yield