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The "Backside Alignment System (IRAS)" is a unit that allows for the alignment of the backside of wafers by being mounted on MPA and PLA. It is designed for using MPA and PLA as backside exposure devices. It is suitable for users considering the purchase of a new backside exposure device. Please feel free to contact us if you have any inquiries. 【Overview】 ■ Main Additional Components - CCD camera for mask alignment - Near-infrared CCD camera for backside wafer alignment - Monitor and computer for image analysis - Backside camera unit stage - Others ■ Compatible Models: MPA600 Series, PLA Series ■ Installation Period: 1.5 weeks ■ Near-infrared specifications are also available * For more details, please download the PDF or contact us.
