JX金属 List of Products and Services

At JX Metal, we propose a "3D moldable electromagnetic wave shielding sheet" to address issues related to electromagnetic wave noise that cause malfunctions and disturbances. By creating a seamless three-dimensional structure for the electromagnetic wave shield, we can cover noise sources without gaps, achieving a high shielding effect. It can handle a wide frequency range of noise, from low frequencies (kHz band) to high frequencies (GHz band). The shielding material uses resin film and highly flexible copper foil, contributing to weight reduction. It is suitable for products with high demand for lightweight design, such as automotive devices and drones. 【Features】 ■ Achieves a magnetic field shielding effect of over 30dB in frequency bands above 500kHz (according to our research) ■ By selecting heat-resistant film, it enables substrate mounting through half-cut attachment ■ Prototypes can be produced in small quantities and with short lead times *We are currently offering materials that introduce the image of problem-solving! You can view them immediately via the download button. *We can provide support free of charge depending on the project and quantity. Please feel free to contact us for more details.

• others

We propose "3D moldable electromagnetic wave shields" as a solution to design challenges in electromagnetic noise countermeasures. By making the electromagnetic wave shield a seamless three-dimensional structure, it can cover noise sources without gaps, demonstrating a high shielding effect. It can handle a wide frequency range of noise, from low frequencies (kHz band) to high frequencies (GHz band). The composite material, which combines resin film and copper foil, is very lightweight, making it suitable for products with high demand for weight reduction, such as automotive equipment and drones. We can propose different resin film materials according to the application. Prototypes can be made starting from just a few pieces. 【Features】 ■ Can be molded into various three-dimensional shapes such as rectangular, hemispherical, and multi-layered ■ Effective in countering noise from various cables and printed circuit boards ■ Excellent corrosion and heat resistance, suitable for a wide range of environments ★ We are offering free initial prototypes for the first five applicants. (Application deadline: August 31, 2021) If you are interested, please apply through the "Contact Us" section below. ★ We are currently providing materials that introduce the problem-solving image using 3D molded electromagnetic wave shields. You can view it immediately from the "PDF Download" section.

• Other electronic parts

Introducing "Metal Powders for 3D Printers" and "3D Printing Manufacturing Support Services" that cater to the needs of various fields such as automotive, aerospace, medical devices, and IT equipment. We offer a range of metal powders including copper, titanium-based metal powders, and tantalum-niobium-based metal powders. Each material is selected based on its unique properties and our group's material development technology. 【3D Printer Metal Powder Lineup】 ◎ Copper Powder (JX Metal) [Under Development]: Improved printability through special surface treatment. ◎ Titanium 64 Alloy Powder (Toho Tech): Ensured flowability by mixing low-cost HDH powder with spherical powder. ◎ Tantalum-Niobium Alloy Powder (Taniobis Japan): Excellent corrosion and heat resistance, suitable for aerospace, medical, and chemical applications. We also have various other powders available. 【Design and Printing Support Services (Alloyed)】 Using our proprietary software, we propose solutions that meet your desired characteristics, including: ◎ Alloy Composition ◎ Design of Printed Objects ◎ Printing Conditions ◎ Post-Processing Heat Treatment Conditions For more details, please refer to the PDF document. Feel free to contact us with any inquiries.

• Other metal materials

The JX Metal Group is globally engaged in businesses related to non-ferrous metals, focusing on copper and rare metals, from resource development and refining to the manufacturing and development of advanced materials and recycling. This document provides a clear introduction to various advanced materials (composite materials) and technologies handled by our company, featuring their characteristics, application examples, and adoption benefits, all illustrated with abundant diagrams. You can also view the technologies of external partner companies that are collaborating with us to explore further possibilities in non-ferrous metals. 【Featured Materials and Technologies (excerpt)】 ■ High-performance copper alloys ■ High-performance copper foil for printed circuit boards ■ Electromagnetic wave shielding sheets that can be 3D molded ■ High-strength rolled copper foil for lithium-ion batteries ■ Precision press processing ■ Sputtering targets for semiconductors ■ Negative thermal expansion materials that enable control of thermal expansion ■ Copper powder for 3D printers, among others *You can view it immediately via "PDF Download." Please feel free to contact us with any inquiries.

• alloy
• Other polymer materials
• Other metal materials

The "Hyper Phosphor Bronze," which is the de facto standard product made of phosphor bronze, offers ultra-high strength (1400MPa), while the "Titanium Copper" provides a balance of high strength (1000MPa) and excellent workability. The "Corson Alloy" boasts conductivity and thermal conductivity more than three times that of phosphor bronze and titanium copper, and the "High Conductivity Alloy" features the highest level of thermal conductivity and low resistivity among copper alloys. 【Features】 ■ Hyper Phosphor Bronze: High strength, high fatigue characteristics, high bendability ■ Titanium Copper: Ultra-high strength, high fatigue characteristics, high bendability, heat resistance ■ Corson Alloy: High strength, high conductivity, high bendability ■ High Conductivity Alloy: High bendability, high thermal conductivity, high conductivity *For more details, please refer to the PDF document or feel free to contact us.

• alloy
• Non-ferrous metals
• Other metal materials

JX Metal Corporation's "Corson Alloy" is a copper alloy that combines high strength, high workability, high conductivity, and high heat resistance, surpassing the typical spring copper alloys like brass. The high-conductivity Corson alloy introduced here maintains strength compared to traditional Corson alloys such as C7025 and C7035, while boasting a high conductivity. It suppresses heat generation in connectors with large current flow, improving current efficiency. With the increase in current flow due to rapid charging and USB4, it can also accommodate areas that traditional Corson alloys cannot. 【Features】 ■ A copper alloy that maintains strength and boasts high conductivity ■ NKC1816-SH and C7025-TM04S improve conductivity at strength levels comparable to C7035 ■ Proven manufacturing down to a thickness of 60μm, suitable for micro connectors ■ NKC4820-EH maintains the strength of C7025 while significantly improving conductivity *For more details, please refer to the PDF document or feel free to contact us.

• alloy
• Board to Board Connectors
• Board to FPC connector

"Titanium copper" is a beryllium-free ultra-high-strength copper alloy. It has higher strength compared to phosphor bronze, allowing for high contact force even in small terminals. Widely applicable as a substitute for beryllium copper. It contributes to improving connection reliability in connectors and electrical components used in high-temperature environments. Additionally, it possesses the highest level of stress relaxation resistance among copper alloys, maintaining contact force even at elevated temperatures. [Features] - Higher strength compared to phosphor bronze - High contact force achievable even in small terminals - Maintains high machinability while being ultra-high strength *For more details, please refer to the PDF document or feel free to contact us.

• alloy
• Board to FPC connector
• Board to Board Connectors

We would like to introduce the 'Press Processing and Resin Molding Processing' handled by JX Metal Precision Technology Co., Ltd. We can process materials ranging from metal foils to thick plates. We offer comprehensive support from press processing and special processing (fine embossing processing) to resin molding. We handle mold design in-house. 【Benefits of Adoption】 ■ Processing available from metal foils to plate thickness ■ Direct surface shapes through etching and press processing ■ Special processing (fine embossing processing) *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract
• Composite Materials
• Spring

We would like to introduce the "Precision Plating Processing" handled by JX Metal Precision Technology Co., Ltd. High-precision spot plating achieves significant cost savings. By applying gold plating only to necessary areas, cost reductions of up to 80% can be achieved. In micro connectors, the adoption of non-laser Ni barrier technology improves design flexibility and reduces costs. We respond to various requirements such as low insertion force and high reliability. Our unique reflow technology controls the diffusion layer and reduces debris. 【Benefits of Adoption】 ■ High-precision spot plating: Achieves significant cost savings ■ Three-dimensional multi-point plating - By applying gold plating only to necessary areas, cost reductions of up to 80% - Adoption of laser-free Ni barrier technology contributes to cost reduction ■ Automotive plug plating: Responds to various requirements such as low insertion force and high reliability ■ High-performance reflow Sn plating - Controls the diffusion layer with our unique reflow technology - Achieves reduction of debris *For more details, please refer to the PDF materials or feel free to contact us.

• Surface treatment contract service
• Printed Circuit Board
• Board to Board Connectors

HS1200 and HS1200-V2 are high-strength rolled copper foils that enhance the strength and heat resistance of conventional tough pitch copper. They can be adjusted to a maximum width of 670mm and a maximum length of 8,000m during slitting. Due to their high strength, they are suitable for batteries that use silicon-based active materials, which have significant volume changes. They have been adopted as negative electrode current collectors for automotive batteries and mobile devices. 【Features】 ■ HS1200 and HS1200-V2 are high-strength rolled copper foils that improve the softening heat resistance of tough pitch copper. ■ They can be adjusted to a maximum width of 670mm and a maximum length of 8,000m during slitting. *For more details, please refer to the PDF materials or feel free to contact us.

• Lithium-ion battery
• Non-ferrous metals
• Printed Circuit Board

"HA&HA-V2 foil" is a high-performance rolled copper foil optimized for FPC applications, which significantly improves characteristics such as crack resistance (high flexibility) and vibration resistance compared to conventional rolled copper foil by increasing the grain size and aligning the crystal orientation. It is suitable for FPCs that require repeated bending and stretching, as well as strict bending processing during assembly in narrow spaces (such as enclosures) and long-term reliability. Additionally, its excellent vibration resistance makes it suitable for automotive FPCs. 【Features】 ■ A high-performance rolled copper foil that achieves high crack resistance (high flexibility) ■ Significantly improved vibration resistance ■ Low elastic modulus, enabling flexible movement *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Electrical equipment parts
• Non-ferrous metals

BHM processing is a copper foil suitable for circuit boards used in high-frequency applications. By reducing magnetic metals, it exhibits excellent transmission characteristics while also maintaining stable substrate properties. 【Features】 ■ Achieves reduced transmission loss by keeping surface roughness low ■ Exhibits good transmission characteristics and stable substrate properties by reducing magnetic metals

• High frequency/microwave parts
• Printed Circuit Board
• antenna

The "JXEFL series" is an electrolytic copper foil with bending characteristics suitable for FPC (Flexible Printed Circuit). We can propose solutions based on your requirements for adhesion to the substrate and circuit processing capabilities. According to your needs, we can provide a one-stop material proposal from our lineup of rolled copper foil and electrolytic copper foil. 【Features】 ■ Capable of accommodating special thicknesses such as 25μm and 50μm ■ Surface treatments can be proposed based on your requirements for adhesion to the substrate, circuit processing capabilities, and high-frequency characteristics *For more details, please refer to the PDF document or feel free to contact us.

• Non-ferrous metals
• Wiring materials
• Printed Circuit Board

The "Electromagnetic Wave Shielding Sn-Cu-PET Foil" has excellent heat resistance and food resistance, and is used as a shielding material for wire harnesses. It is a suitable material for shielding applications of cables used in harsh environments. Compared to braiding, the weight of the shielding material can be reduced to about 1/10, providing good shielding effectiveness in high-frequency ranges. Due to its excellent food resistance and heat resistance, it can be used in various environments. 【Features】 ■ Good shielding effectiveness compared to braiding above 20MHz ■ Thin with a total thickness of 27μm (copper foil 8μm), and lightweight compared to braiding ■ The copper foil surface is plated with Sn, providing good food resistance and heat resistance *For more details, please refer to the PDF document or feel free to contact us.

• Composite Materials
• EMC countermeasure products
• Wiring materials

This product is an "electromagnetic wave shielding sheet" that can shield noise across a wide frequency range. It is a composite shield made of resin film and copper foil, which can be molded into various shapes and can cover the entire noise source without gaps. It demonstrates a magnetic field shielding effect of over 30dB in frequency bands above 500kHz. (Measured by the KEC method) 【Features】 ■ Can shield noise across a wide frequency range ■ Can be molded into various shapes ■ Can cover the entire noise source without gaps ■ Can adopt films suitable for specific applications ■ Extremely lightweight due to its composition of resin film and copper foil *For more details, please refer to the PDF document or feel free to contact us.

• Composite Materials
• Other polymer materials
• EMC countermeasure products

We handle "sputtering targets" for semiconductors. We can provide various high-purity targets that contribute to improving the reliability of devices. These can be used for various semiconductors, including memory and logic. 【Features】 - Achieves low particle (dust) levels and excellent uniformity in the film deposition process, contributing to improved semiconductor yield. - Provides various targets with high purity, low impurities, and high density. *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment
• Memory

We are currently developing 'AISc and KNN (K-Na-Nb) sputtering targets' for Pb-free piezoelectric MEMS as a replacement for PZT (Pb-Zr-Ti). Compared to the conventional AIN, AlScN is expected to have an order of magnitude higher piezoelectric constant. Additionally, we have significantly reduced the oxygen content that affects piezoelectric properties compared to existing AISc targets. **Benefits of adopting our AlSc target:** - AlScN is expected to have an order of magnitude higher piezoelectric constant compared to conventional AIN. - The oxygen content that affects piezoelectric properties has been significantly reduced compared to existing AISc targets. **Benefits of adopting our KNN target:** - KNN is expected to have piezoelectric properties comparable to conventional PZT-based piezoelectric materials. - We can provide KNN targets that enable high-density and high-speed film formation. *For more details, please refer to the PDF document or feel free to contact us.*

• Sputtering Equipment
• Piezoelectric Devices
• filter

Our company offers a wide range of sputtering targets used in devices that handle light. We have a lineup of "ITO, IZO, IGZO targets" for displays that can improve production efficiency, as well as "NS targets" for optical films that enable high performance in devices. These targets can be applied to various uses, including organic EL lighting, optical sensors, and optical films. 【Features of ITO, IZO, IGZO (for display) targets】 - Improvement of production efficiency - High density (>99%): Suppression of nodules - Large area with fewer divisions: Suppression of particles 【Features of NS (for optical film) targets】 - Enables high performance in devices - High transmittance: Improvement of light extraction efficiency - High barrier: Longer lifespan - DC sputtering compatible: Reduction of tact time *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment
• Organic EL
• Other optical parts

We handle sputtering targets for magnetic materials. By utilizing our in-house sputtering equipment and various evaluation devices, we can quickly support our customers' development. We can provide products using suitable manufacturing methods tailored to our customers' needs from a variety of manufacturing technologies. 【Benefits of Adoption】 ■ Provision of high-quality target materials ■ Ability to quickly support customer development ■ Provision of products using suitable manufacturing methods tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.

• Sputtering Equipment
• Memory

We handle the compound semiconductor substrate 'InP/CdZnTe'. The "InP substrate" offers high-precision wafers to improve device quality. The "CdZnTe substrate" achieves high-quality, large-area CdZnTe single crystals using our unique single crystal growth method. 【Features of InP Substrate】 ■ Essential as a material for light communication emitting and receiving devices ■ World-class quality ■ Provides higher precision wafers for improved device quality 【Features of CdZnTe Substrate】 ■ Our unique single crystal growth method ■ Achieves high-quality, large-area CdZnTe single crystals ■ Enables high-precision radiation detection compared to other materials ■ Provides substrates with uniform Zn concentration, making large infrared sensors possible *Please feel free to contact us for more details.

• Sensors
• diode
• Wafer

Our company handles "high-purity metals" suitable for applications such as bonding wire high-purity copper and high-purity metal crucibles. High-purity copper has a low content of impurities such as O, S, P, Fe, and Pb, which helps to keep the electrical resistivity low. High-purity metal crucibles reduce the amount of impurities leaching from the crucible and have good durability, allowing for about 30 continuous uses. 【Features】 ■ Improved conductivity ■ Enhanced corrosion resistance ■ Improved processing characteristics (reduced brittleness, increased ductility) ■ Enhanced property control through added elements (magnetic properties, oxidation resistance, mechanical properties) *Please feel free to contact us for more details.

• Non-ferrous metals
• Rare metals
• Other metal materials

A soft error is a phenomenon where a computer system malfunctions due to changes in memory content caused by cosmic rays or alpha particles. It is known that alpha particles originate from radioactive isotopes (such as U, Th, Po) contained in tin used in solder and plating films of LSI junction materials. With the miniaturization of wiring widths driven by the demands of 5G and IoT, there is a strong need to reduce these particles. Our company has developed a technology to refine Sn purity to 6N (99.9999%), significantly reducing not only the aforementioned radioactive isotopes but also the source material Pb, permanently keeping the alpha particle count below 0.001 cph/cm². We also offer tin oxide, anodes, and methanesulfonic acid tin for electroplating. 【Features】 ■ Alpha particle count is permanently below 0.001 cph/cm², with quality assurance through alpha counter measurements ■ High quality stability and product supply capability ■ Conflict minerals free

• Non-ferrous metals
• Solder
• Memory

JX Metal Corporation offers electroless UBM plating processing services. "UBM (Under Bump Metallurgy)" refers to the metal film formed on semiconductor electrodes, which improves the reliability of solder and wire bonding connections. Our processes can accommodate various customer needs. Additionally, we have comprehensive analysis and evaluation equipment that allows for rapid analysis and evaluation of the plating film. 【Features】 ■ Capable of meeting various customer needs ■ Able to provide good appearance and stable film thickness plating for pads ranging from less than 10μm diameter to over 1cm diameter ■ Plating processing available for thin wafers and TAIKO wafers ■ Stable plating processing possible for 12" wafers ■ Simultaneous plating processing for both sides of the wafer is possible ■ Equipped with comprehensive analysis and evaluation facilities *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Surface treatment contract service
• Wafer

This product is high-quality copper powder that has undergone our unique surface treatment. The surface treatment provides oxidation prevention effects and prevents the rise in oxygen concentration that can hinder the molding process. Additionally, the relative density of molded objects made with pure copper powder is 99.94% for electron beam (EB) methods and 98.56% for laser beam (LB) methods. 【Features】 ■ High-quality copper powder with our unique surface treatment ■ Suppresses the rise in oxygen concentration that hinders molding ■ Exhibits a debinding suppression function in electron beam (EB) methods, improving the freedom of molding ■ Surface treatment is also applicable to copper powder for laser beam (LB) methods ■ Achieves a relative density of 99.94% for EB and 98.56% for LB *For more details, please refer to the PDF document or feel free to contact us.

• Other metal materials
• 3D Printer
• Non-ferrous metals

AMtrinsicⓇ is a tantalum-niobium-based metal powder for 3D printers developed by TANIOBIS GmbH. ■ It features excellent flowability, high tap density, clean spherical powder without satellites, and a sharp particle size distribution. ■ The particle size of AMtrinsicⓇ spherical powder is 10-63μm for Laser Beam Melting (LBM), 63-105μm for Electron Beam Melting (EBM), and 105-150μm for Laser Metal Deposition (LMD). (AMtrinsic is a registered trademark of TANIOBIS GmbH.) *For more details, please refer to the external link page or feel free to contact us using the form below.

• alloy
• 3D Printer
• Rare metals

TANIOBIS GmbH provides various tantalum and niobium metal powders to support electric vehicles, ignition engine operation equipment for cars, space development, and more. Our high-purity tantalum and niobium powders are recognized for their high purity and quality, and are used in medical applications, the aerospace sector, and the energy industry. *For more details, please visit the external link page or feel free to contact us using the form below.

• Rare metals
• Capacitor
• Sputtering Equipment

Our company is developing "high-purity metal chloride" for ALD and CVD applications. With high-purity products that meet the demands of semiconductor processes, the high-purification process at the customer's site becomes unnecessary during precursor synthesis. Additionally, we use high-purity raw materials cultivated from sputtering targets, allowing us to provide high-quality metal chlorides stably. 【Features】 ■ Adoption of high-purity chlorides ■ Reduction or omission of sublimation purification processes ■ Contribution to total cost reduction 【Benefits of Adoption】 ■ No need for high-purification processes at the customer's site during precursor synthesis ■ Use of high-purity raw materials cultivated from sputtering targets ■ Provision of further variations and BCP with mass production technology from the JX Metals Group (including TANIOBIS GmbH and Toho Titanium Co., Ltd.) ■ Integrated system from development to manufacturing ■ Timely one-stop response to customer requests *For more details, please refer to the PDF materials or feel free to contact us.

• Other metal materials
• Rare metals
• CVD Equipment

The AMPERTECⓇ chloride manufactured by TANIOBIS GmbH is a highly reactive compound. Our product has relatively large particle size, which results in less dust dispersion during processing, is less hygroscopic, and has improved flowability, among other advantages. The semiconductor-grade product is the highest purity powder available on the market. (AMPERTEC is a registered trademark of TANIOBIS GmbH.) *For more details, please refer to the external link page or feel free to contact us using the form below.

• Rare metals
• Capacitor
• CVD Equipment

YAG is a crystal with a garnet structure composed of yttrium and aluminum oxide. Compared to single crystals, YAG ceramics (polycrystalline) excel in uniform dopant addition, mass production, and scalability. They can be used in various applications such as laser oscillators and high-power laser amplification media (e.g., MOPA systems). 【Features】 ■ High mass production capability ■ Scalability (up to 6 inches) ■ Easy bonding with other materials and YAG itself ■ Uniform dopant addition ■ High dopant concentration (up to 4at% for Nd) *For more details, please refer to the PDF document or feel free to contact us.

• Ceramics
• Laser Components
• Optical Measuring Instruments

ZrW2O8 (zirconium tungstate) has a negative thermal expansion property that contracts with increasing temperature, allowing for the control of thermal expansion of substrates by creating composites with various materials. 【Features】 ■ Control of thermal expansion of substrates by creating composites with various materials ■ Compatible with both organic and inorganic materials ■ Exhibits stable negative thermal expansion properties over a wide temperature range *For more details, please refer to the PDF document or feel free to contact us.

• Ceramics
• Fine Ceramics

High-purity tantalum and niobium oxide is used as an additive for high-performance camera lenses, improving the refractive index of the lenses. Additionally, it is used in the manufacturing of electronic components such as additives for multilayer ceramic capacitors (MLCC), lithium tantalate for SAW filters, and niobium oxide crystal growth materials. *For more details, please refer to the external link page or feel free to contact us using the form below.

• Secondary Cells/Batteries
• Ceramics
• Capacitor

Ammonium niobate (NAmOx) is a water-soluble, inert white crystalline compound in the atmosphere. It does not require organic solvents for mixing and is suitable as an additive for catalyst production. In addition to ammonium niobate, our company also offers water-soluble tantalum oxalate and niobium oxalate. These products are suitable for mixtures at the molar level. Inorganic compounds known as niobium oxides are composite oxides of niobium and other metals. This material is used in electroceramic components such as piezoelectric ceramics. Our company produces niobium salts including potassium niobate, magnesium niobate, cobalt niobate, lithium niobate, and lanthanum niobate. Niobium hydroxide is used as a precursor for niobium compounds, catalysts, and electroceramics. *For more details, please refer to the external link page or feel free to contact us using the form below.*

• Rare metals
• Other metal materials
• Capacitor