共和機器製作所 List of Products and Services

The "Super Barrel" can achieve very uniform and high-quality plating and surface treatment for precision parts (electrical and semiconductor components), which have traditionally been considered difficult. Electroplating (surface treatment) of precision parts such as chip capacitors and chip resistors has faced issues with size uniformity and defect rates due to their extremely small size. The "Super Barrel" from Kyowa Equipment Manufacturing maintains the high plating efficiency characteristic of barrel plating while improving the defect rates of precision and micro parts. ■ Features - Unique lid opening and closing mechanism that prevents precision parts and micro products from getting stuck or caught on the inner surface. - High opening rate that enhances the stirring efficiency of products inside and excels in plating thickness uniformity. - Specially shaped electrodes that do not deform even with easily bendable products. * For more details, please download the PDF or contact us.

The "Super Barrel" is a barrel plating device that achieves high-quality plating with excellent uniformity and adhesion for precision parts (electrical and semiconductor components). Thanks to its unique lid opening and closing mechanism, even extremely small and thin parts are not pinched by the lid, preventing adhesion and snagging on the inner surface. It maintains high plating efficiency while contributing to the improvement of defect rates. We offer a lineup including ultra-compact experimental models, manual motor-equipped types, and automatic machines. We can provide standard sizes as well as accommodate customization of specifications and dimensions. 【Features】 ■ High opening rate ensures efficient stirring of products inside, resulting in excellent plating thickness uniformity. ■ Specially designed electrodes that do not deform, even for easily bendable products. ■ Capable of meeting needs such as extending barrel lifespan and reducing plating time. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

We would like to introduce a case study that implemented our original "four-sided drop lid (slide opening and closing mechanism)." In terms of design, we manufactured with a lid clearance of at least 0.3 mm for large barrels, 0.2 mm for medium barrels, and 0.1 mm for small barrels, addressing issues with the clamping of extremely small and thin parts. As a result, we successfully eliminated unnecessary sorting processes after the plating process, achieving significant cost reductions. [Case Study] <Problems> ■ We want to eliminate product lid clamping defects and reduce costs. ■ We aim to extend the lifespan by suppressing barrel deformation. <Implementation Effects> ■ Achieved significant cost reductions. ■ Enabled longer lifespan than before. *For more details, please refer to the PDF document or feel free to contact us.

Here is a case study introducing the "open-type inclined barrel" equipped with a liquid circulation pump. In a customer’s operation where ultra-fine precision parts are plated using a conventional sealed barrel with a lid opening and closing, the liquid renewal inside and outside the barrel was poor due to the sealed design. As a result, the metal concentration was depleted during the plating process, leading to defects caused by voltage issues. In response, we proposed our product. Additionally, the design allows for easy one-touch detachment of the barrel, enabling the preparation of multiple barrels with different sizes and specifications for various plating products, thus accommodating small-batch, diverse plating processes. 【Case Study】 <Implementation Effects> ■ Capable of handling small-batch, diverse plating processes ■ Improved uniformity of the plating film ■ Enhanced liquid renewal due to the circulation pump ■ Reduction of sticking and floating of ultra-fine products inside the barrel achieved through radial liquid ejection *For more details, please refer to the PDF document or feel free to contact us.

The "Super Barrel" is a barrel plating device that can perform high-quality plating treatments on precision parts (electrical and semiconductor components) with excellent uniformity and adhesion. Thanks to its unique lid opening and closing mechanism, it minimizes the risk of small and thin parts getting caught in the lid, preventing adhesion and snagging on the inner surface. It contributes to improving defect rates while maintaining high plating efficiency. We offer a lineup including ultra-compact experimental models, manual motor-equipped types, and fully automated models. In addition to standard sizes, we can also accommodate customization of specifications and dimensions. 【Features】 ■ High internal product agitation efficiency, resulting in excellent uniformity of plating thickness ■ Specially designed electrodes that do not deform even for easily bendable products ■ Capable of meeting needs such as extending barrel lifespan and reducing plating time *For more details, please refer to the materials available for download in PDF format. We are also offering a "Case Study Collection" that introduces specification examples! Feel free to contact us for inquiries.