Manufacturing and processing contract
旭電化研究所 立川工場

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We offer "Special Surface Treatment Services." By combining DFR technology and plating technology, we have various techniques such as "bump formation by plating," which allows for the formation of microbumps on patterned circuits, and "direct plating onto special films." 【Special Surface Treatment Technologies】 ■ Bump formation by plating ■ Direct plating onto special films ■ Manufacturing of hollow structures by plating 'HOSPLATE' *For more details, please download the PDF or feel free to contact us.
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