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Defects occurring in the solder printing process of surface mount technology (SMT) are varied. When printing solder on complex uneven substrates or flexible substrates, where high precision is required, defects are more likely to occur due to the type, viscosity, amount, and shape of the solder. Additionally, in the inspection process after solder printing, it is important to detect defects and perform rapid repairs. By combining the jet printer "MY700" with the SPI solder printing inspection device "PI Series 3D SPI," we achieve a cream solder printing process that minimizes defects to nearly zero. If defects occur due to insufficient solder, the defective locations are communicated to the "MY700" along with the PCB's ID code, allowing for corrections through reprinting without the need to clean and reprint the entire substrate. We will be showcasing the actual equipment at the Internepcon event starting from January 25, 2023, so please come and visit us. *For more details, please refer to the PDF materials or feel free to contact us.
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Free membership registrationThe SPI solder printing inspection device 'PI Series 3D SPI' is an inspection solution that allows for the measurement of solder volume with ultra-high precision and ease. The patented Z Reference Technology captures hundreds of references with an ultra-wide 3D angle, enabling high-precision inspection measurements even for small amounts of solder. Additionally, real-time monitoring of the process is possible both online and offline. With automatic programming, accurate inspection programming can be achieved by scanning just one circuit board, ensuring high-quality inspections regardless of the operator's experience level. This inspection device is perfect for EMS providers conducting inspections of small quantities and a variety of products. 【Features】 ■ Captures hundreds of references with an ultra-wide 3D angle of 55×350mm ■ High-quality inspections possible without relying on the operator's experience through automatic programming SPI ■ Accurate measurements without misjudgment in production environments thanks to a unique warpage correction function ■ Works in conjunction with MY700 for repair functions based on PI inspection results *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationThe "MY300" is a mounter that can implement more substrates in the same space. It achieves complete traceability with uncompromising production quality, a wide range of component mounting, inventory accuracy, and individual substrate ID management. We provide a new level of precision and flexibility faster, smaller, and smarter. 【Features】 ■ Set more feeders with the same line length ■ Speed up substrate transport and tool exchange ■ More compact installation area ■ Future-proof component range ■ User-friendly design * For more details, please refer to the PDF materials or feel free to contact us. * You can download the English version of the catalog.
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Free membership registrationThe electronic component reel management system "MYTower" is a component management system that plays a vital role in the pre-process of circuit board assembly (SMT). It allows for systematic management and shipping of multiple electronic component reels, making replacements easy. Additionally, its compact design enables it to be installed close to the circuit board assembly line, saving space. In particular, there are numerous achievements with EMS providers who frequently replace electronic component reels or perform multi-variety circuit board assembly. It can also flexibly respond to replenishment needs during stock shortages. Case study materials are also available. **Features** - No mix-ups with various electronic component reels (increased productivity) - Automatically tracks all stored reels and component quantities - Ensures that the correct components are always shipped and received - Compact design allows for placement near the circuit board assembly line (increased efficiency) - Can store up to 740 reels in a floor area of 1 square meter - Easy one-reel shipping for replenishment using a handheld scanner - A dual terminal option is available, considering the movement lines of people and materials *For more details, please refer to the PDF materials or feel free to contact us.*
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Free membership registrationThe "MY700" is a jet printer and dispenser that enables more capabilities while having an installation area approximately 40% smaller than the previous generation. It can mount various components onto a circuit board and accommodate diverse batches with zero setup time. It is capable of applying solder paste and adhesive quickly and with high precision. Additionally, it makes cavity printing, which is challenging for metal masks, and printing in a bare chip mounting state easy. It contributes to improving the quality and operational rate of difficult applications in a sophisticated manner. 【Features】 ■ Stable solder bonding of fine pads through connection with a metal mask printer ■ Simplification of processes with through-hole printing ■ Usable as a mass production line for small circuit boards or boards with fewer components ■ Minimal manual operation ■ Capable of printing up to 300 dots per second *For more details, please refer to the PDF document or feel free to contact us.
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