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We provide contract manufacturing and processing of semiconductor materials. We accept manufacturing and processing tailored to our customers' requests. We handle thickness processing, thermal oxidation films, etching processing, as well as sputtering and patterning. We offer a wide range of services, including ball bumping, UBM, semiconductor photomask processing, and processing of process materials and various tape materials. 【Contract Processing Services (Partial)】 ■ Thickness processing / thermal oxidation films / etching processing, etc. ■ Sputtering, etc. ■ Patterning, etc. ■ Ball bumping / UBM, etc. ■ Semiconductor photomask processing / glass mask processing / metal mask processing *For more details, please download the PDF or feel free to contact us.
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We accept procurement of semiconductor materials and supplies in small lots. From standard products to new products, we procure materials that meet our customers' specifications. We handle a wide range of items including silicon wafers, compound wafers, solder balls, and photomasks. We also support lead frames, process materials, equipment cleaning materials, and various chemicals. 【Product List (Partial)】 ■ Silicon Wafers/Glass Wafers (small diameter to φ300mm, etc.) ■ Compound Wafers (SiC, GaN, GaAs, InP, Sapphire, etc.) ■ Solder Balls (AuSn, SnAgCuNi, SnAgCu, etc.) ■ Underfill ■ Lead Frames/Transfer Leads/PKG Materials ■ Photomasks/Glass Masks/Metal Masks *For more details, please download the PDF or feel free to contact us.
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We provide OEM services overseas on the premise that the design of products compliant with PSE, full inspection, and PL, etc., are the responsibility of the customer. To carry out OEM at one of the largest factories in China, we offer attractive cost advantages. In the event of defects, we collaborate with the factory, our quality inspection staff, and the customer to resolve the issues. 【Benefits】 ■ Cost ■ Design and Quality ■ Response to Defects ■ Distribution System *Please feel free to contact us for more details.
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