Supporting manufacturing from the procurement of multiple materials to the processing of materials through multiple stages!
We provide contract manufacturing and processing of semiconductor materials. We accept manufacturing and processing tailored to our customers' requests. We handle thickness processing, thermal oxidation films, etching processing, as well as sputtering and patterning. We offer a wide range of services, including ball bumping, UBM, semiconductor photomask processing, and processing of process materials and various tape materials. 【Contract Processing Services (Partial)】 ■ Thickness processing / thermal oxidation films / etching processing, etc. ■ Sputtering, etc. ■ Patterning, etc. ■ Ball bumping / UBM, etc. ■ Semiconductor photomask processing / glass mask processing / metal mask processing *For more details, please download the PDF or feel free to contact us.
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【Other Contract Processing Services】 ■Processing of process materials / various tape materials ■Processing of PTFE jigs / PVC / PET jigs, etc. *For more details, please download the PDF or feel free to contact us.*
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Since our establishment, we have grown as a behind-the-scenes player in "monozukuri" (manufacturing) alongside our customers, starting with the procurement of electronic and electrical materials and semiconductors, and extending to export and import management, quality control, contract manufacturing, product development, and research and development. Moving forward, we will continue to strive as a company to contribute to "monozukuri" that takes into account not only the voices of our customers and the market but also the global environment.
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