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Our company offers a "Vacuum Pressure Curing System" that achieves high-quality and low-cost mass production through complete void removal. It can dissolve and reduce voids caused by physical factors during the application, mounting, and printing processes, as well as voids caused by volatiles during curing. In particular, it demonstrates high effectiveness in narrow gaps and narrow pitches, where void reduction is difficult with conventional ovens. 【Features】 ■ Expansion of material margins through vacuum and pressure systems ■ Improved voidlessness, filling, and adhesion ■ High productivity ■ Establishment of a competitive process *For more details, please download the PDF or feel free to contact us.
