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We provide semiconductor heat sinks using our uniquely developed 'S-CMC'. 'S-CMC' is composed of a multilayer flat plate made of Mo foil and Cu foil, and it is a clad material with superior thermal conductivity and low thermal expansion compared to Mo powder products. It can be applied in various semiconductor fields, but it is particularly suitable as a heat sink for GaN devices used in 4G/5G communications, and it is expected to be used as a heat dissipation material for devices in mobile phone base stations for 5G communication. 【Features of S-CMC】 ■ Patents obtained in Japan, the US, China, and Europe; trademarks registered in Japan, the US, and China ■ The amount of Mo used can be freely selected according to the purpose, and it can accommodate the desired thermal expansion rate ■ Over 10 years of proven performance in satellite communication devices using GaN elements *For more details, please download the PDF or feel free to contact us.
