High thermal conductivity and low thermal expansion semiconductor heat sink made of copper and molybdenum clad material.
We provide semiconductor heat sinks using our uniquely developed 'S-CMC'. 'S-CMC' is composed of a multilayer flat plate made of Mo foil and Cu foil, and it is a clad material with superior thermal conductivity and low thermal expansion compared to Mo powder products. It can be applied in various semiconductor fields, but it is particularly suitable as a heat sink for GaN devices used in 4G/5G communications, and it is expected to be used as a heat dissipation material for devices in mobile phone base stations for 5G communication. 【Features of S-CMC】 ■ Patents obtained in Japan, the US, China, and Europe; trademarks registered in Japan, the US, and China ■ The amount of Mo used can be freely selected according to the purpose, and it can accommodate the desired thermal expansion rate ■ Over 10 years of proven performance in satellite communication devices using GaN elements *For more details, please download the PDF or feel free to contact us.
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【Examples of S-CMC Implementation】 ■ Heat sinks for GaN devices used in 4G/5G communications ■ Heat dissipation substrates for metal packages ■ Heat sinks for ceramic packages ■ Heat dissipation substrates for optical communication devices, etc. *For more details, please download the PDF or feel free to contact us.
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Our company specializes in the integration of the characteristics of various materials, primarily carbon-based materials, to provide solutions that meet our customers' needs. We aspire to make our products the standard in their field and to supply these products widely from Hokkaido to the world. Over the past decade since our establishment, we have faced challenging times, but currently, demand is steadily increasing, and we are seeing a rise in progressive needs from users. We aim for further growth and evolution to meet these demands.