SECO S.p.A List of Products and Services

We would like to introduce the "SOM-SMARC-ADL-N" that we handle. This product performs power-efficient deep learning inference and UHD media processing in a small footprint, designed for video and imaging-intensive applications. The graphics are powered by integrated Intel UHD graphics based on the Intel Xe architecture, supporting up to three video outputs simultaneously at 4K resolution. 【Processor (excerpt)】 ■ Intel Atom x7213E, 2 cores @ 1.7 GHz (3.2 GHz Turbo), 10W TDP, TSN and TCC ■ Intel Atom x7425E, 4 cores @ 1.5 GHz (3.4 GHz Turbo), 12W TDP, TSN and TCC ■ Intel Atom x7211E, 2 cores @ 1.0 GHz (3.2 GHz Turbo), 6W TDP, TSN and TCC ■ Intel Core i3-N305, 8 cores @ 1.8 GHz (3.8 GHz Turbo), 15W TDP, TSN and TCC *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

The "SOM-SMARC-Genio700" is a high-performance product equipped with a multimedia Arm processor and AI accelerator capabilities. It features an 8-core CPU and has an APU performance of 4 TOPS, with a guaranteed supply for embedded applications for ten years. The module complies with the SMARC standard and offers various I/O options. It provides users of SMARC modules in fields such as retail, healthcare, smart homes, and digital signage with a new replacement option. 【Features】 ■ Processor - 2x Arm Cortex-A78 @2.2GHz - 6x Arm Cortex-A55 @2.0GHz - Mali G57 MC3 GPU - AI Accelerator: Mediatek APU3.0 equipped Cadence *For more details, please refer to the PDF document or feel free to contact us.

• LED Module
• Embedded Board Computers
• Other embedded systems (software and hardware)

The AI platform and remote management system 'CLEA' is a software platform that combines AI, IoT, edge, and cloud computing. For example, when CLEA is used for energy management, it can instantly read various data such as temperature and weather, enabling appropriate heating and cooling management, and allowing for optimized energy consumption management. In addition to energy management, it is also utilized in various fields such as industrial automation and EV charging stations. <CLEA Features> ■ Capable of intelligently analyzing data collected from multiple sources ■ No dependency on hardware ■ Modular design that provides flexibility <Application Examples> ■ Building Energy Management System (BEMS) ■ EV Charging System ■ Solar Power Generation System ■ Smart UPS *For more details, please refer to the PDF materials or feel free to contact us.

• Other electronic parts

"WILK" is a SMARC Rel.2.1.1 module equipped with Xilinx Zynq Ultrascale+, Intel Atom x7000E series processors, Intel Core i3 processors, and Intel N series processors. It can be used in an industrial temperature range. The memory consists of implemented LPDDR4X-3733 memory, with a total maximum of 8GB. It is applicable in various fields, including digital signage, infotainment, biomedical/medical devices, and information kiosks. 【Specifications (excerpt)】 ■ CPU: MediaTek Genio 700 ■ Graphics: Mali G57 MC3 GPU ■ Memory: Implemented LPDDR4X-3733 memory, total maximum of 8GB *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"SWAN" is a SMARC Rel. 2.1.1 module equipped with the NXP i.MX 8X application processor. It offers efficient performance that is safety-certifiable according to the SMARC standard. The graphics feature an integrated GPU and support for two simultaneous video outputs. It is applicable in various fields, including automation, biomedical/medical devices, and edge computing. 【Specifications (excerpt)】 ■CPU: NXP i.MX 8X application processor ■Graphics: Integrated GPU, supports two simultaneous video outputs ■Memory: Up to 4GB of implemented LPDDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"RUSSELL" is a SMARC Rel.2.0 compliant module equipped with Xilinx Zynq Ultrascale+ MPSoC. It offers flexible ARM + FPGA heterogeneous processing in a standard form factor. The graphics are powered by an integrated ARM Mali-400 MP2 GPU. It is applicable in various fields, including automotive, avionics, biomedical/medical devices, and robotics. 【Specifications (excerpt)】 ■ CPU: Xilinx Zynq Ultrascale+ CG/EG/EV MPSoCs (C784 package) ■ Graphics: Integrated ARM Mali-400 MP2 GPU ■ Memory: Up to 8GB + 2GB DDR4 implemented *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"MAURY" is a SMARC Rel.2.1.1 module equipped with Xilinx Zynq Ultrascale+ Intel Atom processor x7000E series, Intel Core i3 processor, and Intel processor N series. NXP i.MX 93 in SMARC module, designed for low power applications. It is applicable in various fields including automation, automotive, biomedical/medical devices, and industrial automation and control. 【Specifications (excerpt)】 ■CPU: NXP i.MX 933/935 processor ■Graphics: Up to FHD video output ■Memory: Implemented LPDDR4X / LPDDR4-3200 memory, total maximum of 2GB, 16-bit interface *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"LEXELL" is a 2.1.1 module equipped with the NXP i.MX 8X application processor. It features an integrated graphics processing unit and supports two simultaneous video outputs. It can be used in an industrial temperature range. It is applicable in fields such as digital signage, infotainment, home automation, and multimedia devices. 【Specifications (excerpt)】 ■ CPU: NXP i.MX 8M application processor ■ Graphics: Integrated graphics processing unit, supports two simultaneous video outputs ■ Memory: Implemented LPDDR4-3200 memory, 32-bit interface, up to 4GB *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"LEVY" is a module compliant with SMARC Rel. 2.1, equipped with the NXP i.MX 8X application processor. It features a low-power design for embedded applications in machine learning at a higher level. It is applicable in various fields such as automation, edge computing, HMI, portable devices, and robotics. 【Specifications (excerpt)】 ■ CPU: NXP i.MX 8M Plus application processor ■ Graphics: Integrated GPU, supports three simultaneous video outputs ■ Memory: Up to 4GB of implemented LPDDR4-4000 memory *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"JAGER" is a CPU module equipped with Xilinx Zynq Ultrascale+, Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series. It features high performance, low power consumption, and a rich set of functions. The memory is a dual-channel implementation of LPDDR4-2400 memory. It is applicable in various fields, including automotive, biomedical/medical devices, and multimedia devices. 【Specifications (excerpt)】 ■ CPU: Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series (formerly Apollo Lake) processors ■ Graphics: Intel HD Graphics 500 series controller, equipped with up to 18 execution units ■ Memory: Dual-channel implementation of LPDDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"HALLEY" is a SMARC module specifically designed for functional safety (FuSa) in safety-related systems. It is equipped with Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors. The FuSa-certified Intel Atom x6000E CPU complies with the requirements of IEC 61508 and ISO 13849 regarding functional safety and safety integrity levels. 【Specifications (excerpt)】 ■CPU: Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■Graphics: Gen11 UHD integrated graphics controller, supporting three simultaneous video outputs ■Memory: Quad-channel LPDDR4x implementation with IBECC *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

The "FINLAY" is a SMARC Rel.2.1 compliant module equipped with Xilinx Zynq Ultrascale+ Intel Atom processor x7000E series, Intel Core i3 processor, and Intel processor N series. It enables power-efficient deep learning inference and UHD media processing in a small footprint for video and imaging-intensive applications. The memory is implemented with quad-channel LPDDR5 with IBECC. 【Specifications (excerpt)】 ■ CPU: Intel Atom processor x7000E series, Intel Core i3 processor, Intel processor N series (codename: Alder Lake N) aimed at IoT and multimedia applications. ■ Graphics: Integrated Intel UHD graphics powered by Intel Xe architecture, supporting up to three video outputs simultaneously at 4K resolution. *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"THEBE" is a COM Express Rel.3.0 Basic Type 7 module equipped with an AMD EPYC Embedded 3000 series SoC. It can be used in an industrial temperature range and supports up to four DDR4 SO-DIMM slots with DDR4-2666 memory, compatible with both ECC and non-ECC. This is a scalable product with excellent performance and increased connectivity. Please feel free to contact us for inquiries. 【Features】 ■ CPU: AMD EPYC Embedded 3000 Family SoC ■ Networking: 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Connectivity: 4x USB 3.1; 24 lanes of PCI-e Gen3 lanes ■ Memory: 4 DDR4 SO-DIMM slots supporting ECC DDR4-2666 memory, up to 128 GB *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

We would like to introduce our CPU module 'TARVOS'. It is equipped with Intel's 6th and 7th generation Core/Xeon processors and supports up to three independent displays. The maximum number of cores is 4, making it suitable for various fields including biomedical/medical devices, HMI, gaming, and digital signage-infotainment. Please feel free to contact us if you have any inquiries. 【Features】 ■ CPU: Intel 6th and 7th generation Core/Xeon CPU ■ Graphics: Intel HD Graphics 530/P530/630/P630 ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Memory: 2 x DDR4 So-DIMM slots *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

The "ORION" we handle is a COM-HPC client module equipped with a 12th generation Intel Core processor. Using a PCI-e x4 port, it allows for the connection of M.2 NVMe drives on the carrier board. It features immersive graphics and enhanced AI performance and efficiency in a standard form factor. The SOC can operate in a low power state and is applicable in various fields, including visual computing, transportation, surveillance equipment, and robotics. 【Features】 ■ CPU: 12th generation Intel Core processor ■ Graphics: Intel Iris Xe architecture, up to 96 EUs, up to 4 independent displays ■ Memory: Two DDR5 SO-DIMM slots supporting DDR5-4800 memory *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"OPHELIA" is a COM Express 3.0 Type 6 Compact module equipped with the AMD Ryzen embedded V2000 SoC. The graphics feature an integrated AMD Radeon GPU with up to 7 computing units, supporting up to 4 independent displays. This product is applicable in various fields, including digital signage, infotainment, information kiosks, and monitoring equipment. 【Features】 ■ CPU: Embedded Ryzen V series V2000 FP6 platform with "Zen2" CPU and Radeon GPU core ■ Connectivity: 1x GbE; 1x SuperSpeed USB 10Gbps; 3x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEGx8 Gen3 ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC and non-ECC memory (up to 64 GB) *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"OBERON" is a COM Express 3.0 Basic Type 6 module equipped with Intel Core/Xeon, Core/Xeon/Celeron processors. With outstanding platform performance, it enhances processing capabilities. The maximum number of cores is 6, and the maximum number of threads is 12. It also supports up to three digital display interfaces (DDI), DP 1.2, DVI, and HDMI 1.4. Please feel free to contact us for inquiries. 【Features】 ■Graphics: Intel UHD Graphics 630/P630 architecture, with up to 48 execution units ■Connectivity: 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■Memory: Two DDR4 SO-DIMM slots supporting DDR4-2666 ECC memory, up to 64 GB *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

The "MIRANDA" is a CPU module equipped with Intel Atom X, Intel Celeron J/N, and Intel Pentium N series processors. It features a microSD card slot and can implement an optional eMMC 5.0 drive onboard. The main application fields are avionics, biomedical/medical devices, gaming, and transportation. Please feel free to contact us if you have any inquiries. 【Features】 ■ Graphics: Intel HD Graphics 500 series controller (with up to 18 execution units) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 5x PCI-e x1 Gen2 ■ Memory: Two DDR3L SO-DIMM slots supporting DDR3L-1866 non-ECC memory *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"METIS" is a COM Express Rel.3.0 Compact Type 6 module equipped with the AMD Ryzen Embedded R1000 family SoC. It supports up to three Digital Display Interfaces (DDI), including DP1.3, DVI, and HDMI 1.4/2.0, allowing for three independent displays. It is applicable in a wide range of fields such as digital signage, infotainment, and biomedical applications. Please feel free to contact us for inquiries. 【Features】 ■ CPU: AMD Ryzen Embedded R1000 Processor ■ Graphics: AMD Radeon Vega GPU (with 3 compute units) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; up to 5 PCI-e x1; PEG x4 Gen3 ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-2400 ECC memory *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"LARISSA" is a COM Express 3.0 Compact Type 6 module equipped with 8th generation Intel Core and Celeron U series processors. The operating temperature for the commercial version is 0°C to +60°C, and the dimensions are 95x95mm. It features two DDR4 SODIMM slots that support DDR4-2400 memory. It can be applied in various fields, including biomedical/medical devices, edge computing, HMI, information kiosks, and measurement instruments. 【Features】 ■ CPU: 8th generation Intel Core and 15W TDP Celeron 4000 series processors (formerly Whiskey Lake) ■ Graphics: Intel UHD Graphics 620 / 610 ■ Connectivity: 4 x USB 3.1; 8 x USB 2.0, up to 8 x PCI-e x 1 ■ Memory: Two DDR4 SODIMM slots supporting DDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"LAGOON" is a CPU module that can be used in industrial temperature ranges. It achieves processing power, high-performance graphics, and top-class connectivity with the COM-HPC modular solution. It supports up to three simultaneous video outputs and can connect M.2 NVMe drives on the carrier board using a PCI-e x4 port. 【Features】 ■ CPU: 11th generation Intel Xeon, Core, and Celeron processors ■ Graphics: Intel Iris Xe Graphics Core Gen12 GPU with up to 32 EU and up to four independent displays ■ Connectivity: 2x USB 4; 2x USB 3.2 Gen 2x2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; up to 2x 2.5GbE *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"JULIET" is a COM Express Rel. 3.0 Basic Type 7 module equipped with an Intel Xeon D-1700 processor. It can be used in industrial temperature ranges and is applicable in fields such as industrial automation and control, telecommunications, and server high-performance computing. Additionally, it supports up to four DDR4 SO-DIMM slots with ECC-enabled DDR4-2933 memory. 【Features】 ■ CPU: Intel Xeon D-1700 processor ■ Networking: 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Connectivity: 4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"EUPHORIA" is a COM Express 3.1 Type 6 Compact module equipped with Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors. It can be used in an industrial temperature range. It supports up to three independent displays, with an operating temperature of 0°C to +60°C for commercial versions and -40°C to +85°C for industrial versions. It is applicable in a wide range of fields, including industrial automation and control, in-vehicle infotainment systems, robotics, and telecommunications. 【Features】 ■ CPU: Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■ Graphics: Integrated Intel Gen11 UHD Graphics controller ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 IBECC memory, up to 32GB *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"ECHO" is a COM Express Basic Type 6 module equipped with an Intel Haswell processor. It supports three simultaneous video outputs and is compatible with DirectX 11 and OpenGL 4.0. It can be applied in fields such as biomedical/medical devices and gaming. This high-performance product features a scalable form factor that accommodates various designs. Please feel free to contact us for inquiries. 【Features】 ■ CPU: Intel Haswell family CPU ■ Graphics: Integrated Intel HD Graphics 4600 ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 7x PCI-e x1 ■ Memory: Up to 16GB DDR3L-1600 with two SO-DIMM slots *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

The product we handle, 'CHARON', is a COM Express Rel.3.0 Compact Type 6 module equipped with an AMD Ryzen embedded V1000 processor. The graphics feature an AMD Radeon Vega GPU with up to 11 computing units and supports DirectX 12. It can be used in industrial temperature ranges. This product is suitable for fields such as biomedical/medical devices and digital signage-infotainment. 【Features】 ■ CPU: AMD Ryzen embedded V1000 processor ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen 3 ■ Memory: Supports up to two DDR4 SO-DIMM slots with DDR4-3200 ECC memory *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"CHANDRA" is a CPU module equipped with Intel Atom E3800 and Celeron families. It offers versatility and robustness, and can be used in industrial temperature ranges. It is applicable in a wide range of fields such as avionics, industrial automation and control, and transportation. Additionally, the video interface can be switched to manage additional DDI, embedded display port, or 18/24-bit single/dual-channel LVDS interfaces. 【Features】 ■ CPU: Intel Atom E3800 and Celeron family ■ Graphics: Integrated Intel HD Graphics 4000 series controller ■ Connectivity: 4x USB 3.0; 7x USB 2.0; 4x PCI-e x1 Gen2 ■ Memory: DDR3L SO-DIMM slots x2, up to 8GB *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"CARINA" is a COM-HPC client module equipped with 11th generation Intel Core and Celeron processors. It features Intel Iris Xe graphics with up to 96 execution units (EU) and supports up to four independent displays. It is applicable in various fields such as automation, edge computing, information kiosks, robotics, and thin clients. 【Features】 ■ CPU: 11th generation Intel Core processors and Intel Celeron processors ■ Connectivity: 4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3; 1x PCI-e x4 Gen4; up to 2x 2.5GbE ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"CALYPSO" is a CPU module equipped with an 11th generation Intel Core processor. It can be used in industrial temperature ranges and is applicable in various fields such as biomedical/medical devices, measurement instruments, and transportation. It offers high-performance and responsive CPU and GPU computing in a COM Express Compact form factor. Please feel free to contact us for inquiries. 【Features】 ■ CPU: Intel Core series (formerly Tiger Lake UP3) processor ■ Graphics: Integrated Intel Iris Xe graphics with up to 96 execution units ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 IBECC memory, up to 64GB *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

The "CALLISTO" we handle is a COM Express 3.1 Type 6 Basic module equipped with a 13th generation Intel processor. It can be used in industrial temperature ranges. It enables intensive video processing and AI-based analysis for edge devices in challenging environments. It can be applied in various fields, including automation, biomedical/medical devices, surveillance equipment, and transportation. 【Features】 ■ CPU: 13th generation Intel processor aimed at IoT applications ■ Graphics: Embedded Intel Iris Xe graphics with up to 96 execution units ■ Connectivity: 1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4 ■ Memory: Two DDR5 SO-DIMM slots supporting DDR5-4800 IBECC memory *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"AMOS" is a CPU module equipped with AMD embedded 3rd generation R series SoC, G series SoC-I, or G series SoC-J. It can be used in industrial temperature ranges. The memory supports two SO-DIMM slots for DDR4 ECC modules and non-ECC modules. This product is applicable in a wide range of fields such as gaming, medical, and digital signage-infotainment. 【Features】 ■ CPU: AMD embedded 3rd generation R series SoC or G series SoC-I ■ Graphics: AMD Radeon 3rd generation Graphics Core Next (GCN) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3 ■ Memory: Supports two SO-DIMM slots for DDR4 ECC modules and non-ECC modules *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"NEMBUS" is a μQseven standard module equipped with the NXP i.MX 6 processor. It achieves a compact and highly flexible OTS module at a unique cost. It is used in various fields such as HMI, handheld terminals, and wireless technology. It can be used in an industrial temperature range, and the memory can be equipped with up to 1GB of onboard DDR3L. 【Features】 ■ CPU: Single-core/Dual-core Lite (Arm Cortex A9 core) ■ Connectivity: Fast Ethernet, GPI/O ■ Graphics: Dedicated 2D/3D graphics processor ■ Memory: Up to 1GB of onboard DDR3L ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

The "NAOS" is a Qseven Rel. 2.1 compliant module equipped with Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series (Apollo Lake) processors. It can be used in an industrial temperature range. It features high graphic performance and a low power consumption design due to extreme temperatures. It is used in various fields, including automotive, gaming, and mobile devices. 【Features】 ■ CPU - Intel Atom X series, Intel Celeron J/N series, Intel Pentium N series ■ Connectivity - USB 3.0 x 2, PCI-e x 4, USB 2.0 x 6 *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"MIRA" is a Qseven Rel. 2.1 compliant module equipped with the NXP i.MX 8M application processor. It can be used in industrial temperature ranges. The graphics feature an integrated GPU and support for two simultaneous video outputs. This is an embedded system Qseven solution suitable for various fields such as home automation, multimedia devices, and transportation. 【Features】 ■ CPU: NXP i.MX 8M application processor ■ Connectivity: USB 3.0 x 1, USB 2.0 x 4, PCI-e x1 Gen2 x 2, etc. ■ Graphics: Integrated GPU, supports two simultaneous video outputs ■ Memory: Up to 4GB of DDR4-2400 memory installed ■ Usable in industrial temperature ranges *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"MAIA" is a CPU module that leverages the wide scalability offered by the Qseven form factor and the i.MX 8 family. It is equipped with the NXP i.MX 8 application processor. The graphics feature an integrated GPU that supports two simultaneous video outputs. It can be applied in various fields such as industrial automation and control, smart vision, and vending machines. 【Features】 ■CPU - NXP i.MX 8 application processor ■Connectivity - USB 3.0 x 1, PCI-e x1 Gen3, CSI camera connector, boot selection signal ■Graphics - Integrated GPU, supports two simultaneous video outputs *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"LIBERTAS" is a μQseven standard module equipped with the NXP i.MX 6 processor. It features an optimal balance of performance and size, and can be used in industrial temperature ranges. It is suitable for fields such as automation, biomedical/medical devices, HMI, handheld terminals, and wireless technology. Please feel free to contact us if you have any inquiries. 【Features】 ■ CPU: Single-core, dual-core, quad-core (Arm Cortex-A9 core) ■ Connectivity: USB 2.0 × 4, Serial ports × 2, CAN bus ■ Graphics: Dedicated 2D/3D graphics processor ■ Memory: Up to 2GB of DDR3L ■ Usable in industrial temperature ranges *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"ELECTRA" is a μQseven standard module equipped with NXP i.MX 8M Mini & NXP i.MX 8M Nano processors. Built on advanced 14LPC FinFET process technology, this MPU achieves high speed and improved power efficiency. It is used in fields such as HMI, multimedia devices, thin clients, and vending machines. 【Features】 ■ CPU ・NXP i.MX 8M Mini family / i.MX 8M Nano family ■ Connectivity ・Gigabit Ethernet, optional Wi-Fi + BT 5.0, UART x 2, optional CAN, USB 2.0 x 5, PCI-e x1 x 1 *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"ATLAS" is a Time Coordinated Computing Qseven Rel. 2.1 compliant module equipped with Intel Atom X6000E series, Intel Pentium, Celeron N, and J series SoCs (Elkhart Lake). It achieves high computing and graphics performance in a Qseven form factor. It is applicable in various fields such as gaming, multimedia devices, and visual computing. 【Features】 ■CPU - Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■Connectivity - GbE x 1, high-precision time protocol IEEE 1588, USB 2.0 x 6, SuperSpeed USB 10Gbps x 2, up to PCI-e x 4 *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"ARCALIS" is a Qseven Rel. 2.1 compliant module equipped with the NXP i.MX 8X application processor. It features a compact and safety-certified Qseven module with a high-efficiency architecture. It is used in various fields such as automation, edge computing, energy, HMI, and industrial automation and control. 【Features】 ■ CPU: NXP i.MX 8X application processor ■ Graphics: Integrated GPU, supports two simultaneous video outputs ■ Memory: Up to 4GB of implemented LPDDR4-2400 memory ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"ALKES" is a Qseven standard module equipped with the NXP i.MX 6 processor. It features an optimal balance of performance and power. It is suitable for various fields, including automotive and avionics, energy, industrial automation and control, robotics, and surveillance equipment. Please feel free to contact us when you need assistance. 【Features】 ■ CPU: Single-core, dual-core, quad-core (Arm Cortex-A9 core) ■ Connectivity: 2 serial ports, CAN port ■ Graphics: Dedicated 2D/3D graphics processor ■ Memory: Capable of supporting up to 4GB of DDR3L ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"KUMA" is a μQseven Rel. 2.0 module equipped with Intel Atom E3800 and Celeron processors (Bay Trail). The dimensions are 40×70mm (1.57 inches × 2.76 inches). It is applicable in various fields such as biomedical/medical devices, industrial automation and control, handheld terminals, robotics, and surveillance equipment. It is a minimum-class x86 standard module developed at a unique cost. 【Features】 ■ CPU: Intel Atom E3800 and Celeron family ■ Connectivity: USB 2.0 x 4, USB 3.0 x 1, PCI-e x1 x 3, LPC bus ■ Graphics: Integrated Intel HD Graphics 4000 series controller ■ Memory: Up to 4GB of single-channel DDR3L memory *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"AVIOR" is a CPU module equipped with Intel Atom E3800 and Celeron family (Bay Trail) processors. It offers x86 performance in a low-power module and can be used in industrial temperature ranges. It is suitable for fields such as biomedical/medical devices, HMI, industrial automation and control, and measurement instruments. 【Features】 ■ CPU: Intel Atom E3800, Celeron family (System-on-Chip) ■ Connectivity: USB 2.0 × 6, USB 3.0 × 1, PCI-e x1 × 3 ■ Graphics: Integrated Intel HD Graphics controller ■ Memory: Up to 8GB of dual-channel DDR3L 1333MHz ■ Usable in industrial temperature ranges *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

"ASTERION" is a mobile CPU module equipped with eMMC and a camera interface. It features Intel Atom E3800 and Celeron processors (Bay Trail). It is applicable in fields such as HMI, industrial automation and control, in-vehicle infotainment systems, and portable devices. 【Features】 ■ CPU: Intel Atom E3800 and Celeron family ■ Connectivity: USB 2.0 × 6, USB 3.0 × 1, PCI-e x1 × 3 ■ Graphics: Integrated Intel HD Graphics 4000 series controller ■ Memory: Up to 8GB of dual-channel DDR3L 1333MHz ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

In this document, we introduce FANNAL Electronics' "Touch Display Total Solution." We provide an introduction to solutions and services, including "TFT displays" and "optical bonding," as well as know-how on knob touch, blackening prevention, and 3A processing. We support software adjustments for the operating environment of terminal products and offer long-term technical support and logistics support from the design phase to the after-service phase. [Contents (partial)] ■ High-tech companies ■ Part of group global expansion ■ Solutions and services - TPM - PCAP - TFT displays *For more details, please refer to the PDF document or feel free to contact us.

• Touch Panel
• LCD display

We would like to introduce the "Touch Display Multifunction Device" manufactured by FANNAL Electronics, which we handle. It has an IP65 waterproof and dustproof rating, a wide applicable temperature range, and high brightness. It features customizable interfaces such as VGA, DVI-D, Video, S-Video, HDMI, Audio-out, Audio-in, and USB. 【Features】 ■ Size: 7" to 55" ■ Wide applicable temperature range ■ IP65 waterproof and dustproof ■ High brightness ■ Customizable interfaces: VGA, DVI-D, Video, S-Video, HDMI, Audio-out, Audio-in, USB, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Touch Panel
• LCD display

We would like to introduce the "Optical Bonding" manufactured by FANNAL Electronics, which we handle. The bonding series can accommodate "OCA" up to 15.6", and "LOCA/OCR" and "Silicon" up to 32". It has a high yield rate and can also support optical bonding with a metal shell. 【Features】 ■ Supports optical bonding with a metal shell ■ Newton ring elimination ■ High yield rate ■ Cost optimization *For more details, please refer to the PDF materials or feel free to contact us.

• Touch Panel
• LCD display