SECO S.p.A Product Lineup

The "TFT Display" manufactured by FANNAL Electronics, which we handle, can provide long-term stable product supply. It features customizable LCD panels, backlights, and interfaces (RGB/CPU/MIPI/LVDS/EDP), and supports ICs up to 4+2. We design and develop our own relay boards, supporting VGA/DVI/HDMI/Type-C, among others. 【Features】 ■ Size: 3.5" to 15.6" ■ Customizable LCD panels, backlights, and interfaces (RGB/CPU/MIPI/LVDS/EDP) ■ Long-term stable product supply ■ LED lifespan: 20k/30k/50k hours ■ We design and develop our own relay boards, supporting VGA/DVI/HDMI/Type-C, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Touch Panel
• LCD display

The "PCAP" from FANNAL Electronics, which we handle, offers high stability and interference resistance. It features cutting-edge optical bonding processes in the industry. If necessary, product performance can meet ACE-Q100/IATF16949 standards. Additionally, it supports multi-touch, waterproof touch, and glove touch control, allowing customization of the cover lens surface treatment. 【Features】 ■ Maximum supported size: 32" ■ In-house design: Touch sensor and touch IC solutions ■ Specializing in G+G manufacturing, also capable of G+F+F ■ High stability and interference resistance ■ In-house production: PCAP + TFT optical bonding ■ Customizable cover lens surface treatment: AG/AR/AF/AB *For more details, please refer to the PDF document or feel free to contact us.

• Touch Panel
• LCD display

We would like to introduce the 'TPM' manufactured by FANNAL Electronics, which we handle. The "PCAP (Projected Capacitive Touch Panel)" is composed of Glass/Glass (G+G) and Glass/Film/Film (G+F+F). The sizes range from 1.8" to 55". In addition, we also offer "TFT Displays" that can be customized for LCD, backlight, and FPC, as well as "Optical Bonding" that meets performance measurement requirements in harsh environments. 【Features】 <PCAP (Projected Capacitive Touch Panel)> ■ Composition: Glass/Glass (G+G), Glass/Film/Film (G+F+F) ■ Size: 1.8" to 55" ■ Multi-touch solution *For more details, please refer to the PDF materials or feel free to contact us.

• Touch Panel
• LCD display

Embedded BOX PCs and panel PCs system products, as of May 2023, all of SECO's lineup is included.

• Embedded Board Computers

Board products such as CPU modules and compact embedded boards, as of May 2023, include the entire lineup from SECO.

• Embedded Board Computers

■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Flexibility in function increase or decrease due to BOM component changes ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible to design carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successors ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available, including Intel, AMD, and NXP ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Many options available, including Intel, AMD, NXP, etc. ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to achieve carrier board design compatible with both ARM and x86 ■Many options available, including Intel, AMD, NXP, etc. ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available, including Intel, AMD, and NXP ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick time to market

• Embedded Board Computers

■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available such as Intel, AMD, NXP ■Flexibility in functionality increase or decrease through BOM component changes ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available such as Intel, AMD, NXP ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available, including Intel, AMD, NXP, etc. ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch

• Embedded Board Computers

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available such as Intel, AMD, NXP ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch

• Embedded Board Computers