ローム・メカテック Product Lineup

We would like to outsource because it is difficult to achieve the required precision in-house. We do not have enough manufacturing capacity for parts processing. Do you have such concerns? With our core technology in precision mold processing, we can handle the machining of precision parts specified by your company.

• Plastic Mould

This is a device that automatically processes the cutting and bending of lead terminals for semiconductor electronic components, aligns and transfers them to a transport tray after cutting them into individual pieces. It is equipped with a 3-ton servo press with 2 heads. We design the equipment to meet customer needs. Additionally, we handle everything from design to manufacturing for various types of tie bar cutting, lead cutting, forming, and more, tailored to the equipment.

• Other semiconductor manufacturing equipment

"We urgently want to improve the existing package at the request of the end user." "We suddenly need sample products for the exhibition." "Do you have any requests such as wanting to confirm specifications with prototypes before mass production?" In response to the customer's voice of wanting to "prepare mold tooling quickly and at a low cost," our company offers the "7DAYS Prototype Service." We can produce prototype mold tooling in as little as 7 days, contributing to the reduction of the development period for semiconductor packages. 【Features】 ■ Sample creation in as little as 7 days ■ Shortening the development period for semiconductor packages ■ Reducing lead time for design samples ■ Providing small quantities of samples at low cost ■ Cost reduction possible by manufacturing only the reconfiguration parts *For more details, please refer to the PDF document or feel free to contact us.*

• Prototype Services

"We urgently want to improve the existing PKG at the request of the end user." "We suddenly need sample products for the exhibition." "Do you have any requests such as wanting to confirm specifications with prototypes before mass production?" In response to customer requests like "I want to prepare lead frames, mold dies, tie bar cut dies, and cut/forming dies quickly and at a low cost," our company offers the "7DAYS Prototype Service." We can produce lead frames, prototype mold dies, and prototype trim forming dies in as little as 7 days, contributing to the reduction of development time for semiconductor packages. 【Features】 ■ Sample creation in as little as 7 days ■ Reduction of development time for semiconductor packages ■ Shortened lead time for design samples ■ Affordable provision of very small quantities of samples ■ Cost reduction possible by manufacturing only the reconfiguration parts 【List of Available Processes】 ◆ Gate cut ◆ Tie bar cut (dam bar cut) ◆ Support cut ◆ Lead cut ◆ Singulation (individual piece separation) ◆ Lead forming *For more details, please refer to the PDF document or feel free to contact us.

• Prototype Services

"We urgently want to improve the existing package based on end-user requests." "We suddenly need sample products for the exhibition." "Do you have any requests such as wanting to confirm specifications with prototypes before mass production?" In response to the customer voice stating, "We want to prepare lead frames quickly and at a low cost," our company offers the "7DAYS Prototype Service." Instead of the conventional etching process for lead frame prototypes, we can manufacture lead frames in as little as 7 days using MERC processing (punching and knockout processing), contributing to the reduction of the semiconductor package development period. 【Features】 ■ Sample creation in as little as 7 days ■ Shortening of semiconductor package development time ■ Reduced lead time for design samples ■ Affordable provision of very small quantities of samples ■ No initial costs are generally required *For more details, please refer to the PDF document or feel free to contact us.

• Prototype Services

【Features】 - Adoption of AC servo motors for energy saving - Digital adjustment of open height allows compatibility with various molds - Use of precision ball screws enables high-accuracy positioning - Customizable processing conditions such as stop time specification, ram speed, and position specification to match the workpiece We also accept inquiries for the design of semiconductor package lead forming cut molds tailored to tabletop servo presses.

• Other semiconductor manufacturing equipment
• Press Dies