We also offer proposals for handling leads after molding, from the equipment to the mold!
This is a device that automatically processes the cutting and bending of lead terminals for semiconductor electronic components, aligns and transfers them to a transport tray after cutting them into individual pieces. It is equipped with a 3-ton servo press with 2 heads. We design the equipment to meet customer needs. Additionally, we handle everything from design to manufacturing for various types of tie bar cutting, lead cutting, forming, and more, tailored to the equipment.
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basic information
◆Main body of the processing machine: Width 1350mm, Depth 660mm, Height 1700mm, Weight 1000kg, with dust collector included ◆Power supply: 3-phase 200V ◆Rated: 3t 2-head servo press (conventional molds can also be mounted) ◆Compatible frame: Width 20–70mm, total length up to 240mm (matrix compatible, up to 4 rows) ◆Processing capacity: 40–60 pcs/min (reference value) ◆QC STOP function: Sampling inspection possible ◆Operation panel: Supports 3 languages (English, Japanese, Thai) ◆Option: Image inspection processing device (uses 1.9 million pixel camera, recognizes up to 50μ in an area of 80×60mm)
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It is a device for performing lead processing after molding.
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The products made by Rohm Mechatronics are the foundational components for semiconductor manufacturing.