[Trim Forming Attachment] Supports tray alignment and transfer! Introduction of the lead frame processing device after molding (TF device) Fusion MTF1.

We also propose the processing of leads after molding, from the device to the mold! This is a trim forming device that automatically processes the cutting and bending of lead terminals for semiconductor electronic components, followed by cutting them into individual pieces and aligning and transferring them to a transport tray. It is equipped with a 3-ton servo press with 2 heads. We design the device to meet customer needs. Additionally, we handle everything from design to manufacturing of various types of tie bar cutting molds, lead cutting molds, forming molds, and more to match the device.

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