上野精機 List of Products and Services

The "RS-evo" is a high-speed handler for wafer pickup designed for WLCSP and bare die, compatible with 12-inch wafers. As a pickup handler for 12-inch wafers, it achieves 70,000 UPH (70,000 units per hour). It also supports six-sided visual inspection. Please feel free to contact us if you have any inquiries. 【Features】 ■ Damage-free transfer (patented technology) ■ Supports ultra-small WLCSP and bare die (0.4×0.2mm) ■ Micro-crack detection through six-sided visual inspection (IR inspection available as an option) ■ Integration of electrical testing is also possible *For more details, please download the PDF or feel free to contact us.

• Semiconductor inspection/test equipment

The "LT-evo" is a Daisota test handler that boasts world-class speed. It achieves a productivity of 70,000 UPH (70,000 units per hour) and damage-free transport of ultra-small products (0.4mm x 0.2mm) through patented technology, and it also supports six-sided visual inspection. Please feel free to contact us if you have any inquiries. 【Features】 ■ Damage-free transfer (patented technology) ■ Compatible with ultra-small devices (0.4 x 0.2mm) ■ Integrated system for testing, six-sided visual inspection, laser marking, and taping *For more details, please download the PDF or feel free to contact us.

• Semiconductor inspection/test equipment