Supports thin products with a minimum size of 0.4×0.2mm and a thickness of 0.1mm or less.
The "RS-evo" is a high-speed handler for wafer pickup designed for WLCSP and bare die, compatible with 12-inch wafers. As a pickup handler for 12-inch wafers, it achieves 70,000 UPH (70,000 units per hour). It also supports six-sided visual inspection. Please feel free to contact us if you have any inquiries. 【Features】 ■ Damage-free transfer (patented technology) ■ Supports ultra-small WLCSP and bare die (0.4×0.2mm) ■ Micro-crack detection through six-sided visual inspection (IR inspection available as an option) ■ Integration of electrical testing is also possible *For more details, please download the PDF or feel free to contact us.
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【Target Products】 ■WLCSP ■Bare Die ■Power Devices ■Discrete Semiconductors ■FOWLP ■Electronic Components *For more details, please download the PDF or feel free to contact us.
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Our company is a device manufacturer that boasts a world-class share in the niche field of inspection equipment for semiconductors and electronic components, established in 1972. We have built a one-stop production system that consistently handles everything from development, design, manufacturing, to maintenance in-house. We pursue uncompromising manufacturing with our unique technological capabilities and have been selected as one of the "Top 100 Global Niche Companies" by the Ministry of Economy, Trade and Industry. Please feel free to contact us if you have any inquiries.