齊藤精機 List of Products and Services

Based on the technology cultivated with silicon cylindrical grinding machines, we developed a cylindrical grinding machine for SiC. SiC, which is expected to be the next-generation power semiconductor, has a high processing difficulty, and we have overcome many challenges to complete it as production equipment.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment

【Overview】 A large domestic glass processing machine with a processing size of 2500mm × 3600mm. It enables precise 2.5-dimensional processing using NC 5-axis and three types of angular heads. Equipped with self-developed software for glass processing, featuring CAD/CAM with 3D simulation. Capable of ultra-high-speed grinding for fine processing. Rectangular outer perimeter accuracy can be pursued to within 0.05mm, and vertical position accuracy can be pursued to within 0.10mm. 【CAD/CAM】 SGK-CAD/CAM software for glass processing. Displays tool paths using the same tool for four mounted glass sheets and allows for the inversion of transparent glass. The processing state can be visually confirmed in 3D on a computer by changing the orientation. 【Angular Head】 By attaching three types of angular heads to the operation of NC-X, Y, Z, and C axes, the processing area is expanded. It is possible to pursue various advantages such as 2.5-dimensional processing, reduction of processing tact, improvement of processing accuracy, enhancement of finish quality, and prolongation of tool wear life. Processing software for various angular heads is standardly equipped with SGK-CAD/CAM software.

• Other processing machines

The "SMG-XN-812-40280" is a semiconductor automatic cylindrical grinding machine for grinding azukuron ingots. It is a fully automatic machine that performs cylindrical grinding of long azukuron ingots using a combination of rough and fine grinding wheels, explores X-ray crystal orientation, and processes OF surfaces and V-notches. It also features measurement functions for roundness and cylindrical shapes, as well as grinding wheel wear correction software and load control functions. Please feel free to contact us if you have any inquiries. 【Specifications】 ■ Ingot size: 8", 12" × 2,800l / 500kg ■ V-notch depth: Max 1.64mm ■ Utility: 10kVA / 220V / 50A / 60Hz ■ Dimensions a b h: 6,750 / 4,020 / 2,700mm ■ Machine weight: 13,000kg * For more details, please download the PDF or feel free to contact us.

• Flat/Shaped/Vertical Cutting Machine
• Grinding Machine
• Other semiconductor manufacturing equipment

The "SMB-812-40280" is a semiconductor automatic cutting machine that performs the separation of both ends of long silicon ingots using a band saw, as well as cutting to specified block sizes and sampling cuts for each block. Laser/ink printing can be applied to blocks and samples, and a LAN connection system for logistics sorting is also possible. Additionally, fully automatic loaders and unloaders can be accommodated based on specific requirements. Please feel free to contact us if you have any requests. 【Specifications】 ■ Ingots size: 8", 12" × 2,800l / 500kg ■ Block length: 100–450mm ■ Sample thickness: 1.2–5.0mm ■ Utility: 10kVA / 220V / 50A / 60Hz ■ Dimensions a b h: 8,200 / 4,650 / 3,500mm ■ Machine weight: 19,400kg *For more details, please download the PDF or feel free to contact us.

• Other semiconductor manufacturing equipment