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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Wafer processing/polishing equipment
  6. Cylindrical grinding machine for SiC

Cylindrical grinding machine for SiC

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last updated:Feb 01, 2024

齊藤精機
齊藤精機
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Developing cylindrical polishing for SiC, which is expected to be the next-generation power semiconductor!

Based on the technology cultivated with silicon cylindrical grinding machines, we developed a cylindrical grinding machine for SiC. SiC, which is expected to be the next-generation power semiconductor, has a high processing difficulty, and we have overcome many challenges to complete it as production equipment.

    Wafer processing/polishing equipmentOther semiconductor manufacturing equipment
id="product-main-img"

Cylindrical grinding machine for SiC

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basic information

SiC dedicated polishing machine

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Used for polishing cylindrical SiC Since we handle the design, please feel free to contact us regarding specifications and options.

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  • R521_加工済.jpg

    Cylindrical grinding machine for SiC

Company information

齊藤精機

齊藤精機

Industrial Machinery

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Our company is engaged in the design, manufacturing, and system development of silicon and compound semiconductors, glass processing, various specialized machines for the aerospace and automotive industries, and precision equipment. We have a well-equipped factory infrastructure. With a factory height of 9 meters and a 7.5-ton crane, we have ample space for the assembly of large equipment. Additionally, we handle precision machining finishing and three-dimensional inspections in-house in a temperature-controlled room. Currently, we are developing a mass production device for vertical glass polishing. We have a track record of selling CNC centers for glass grinding. If you are interested, please feel free to contact us. As a manufacturer of various specialized machines and equipment, we will continue to strive for further evolution. If you have any inquiries or questions, please do not hesitate to reach out. 【Some Achievements】 Semiconductor-related: Polishing machines, cutting machines, and measuring machines with over 80% global market share. Automotive-related: Automatic press-in machines, large cutting machines. Industrial-related: Powder coating machines, various slings, power control units, touch panel boxes. Aerospace-related: Specialized tube cutting machines, inspection benches, etc.

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