Developing cylindrical polishing for SiC, which is expected to be the next-generation power semiconductor!
Based on the technology cultivated with silicon cylindrical grinding machines, we developed a cylindrical grinding machine for SiC. SiC, which is expected to be the next-generation power semiconductor, has a high processing difficulty, and we have overcome many challenges to complete it as production equipment.
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basic information
SiC dedicated polishing machine
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Applications/Examples of results
Used for polishing cylindrical SiC Since we handle the design, please feel free to contact us regarding specifications and options.
Detailed information
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Cylindrical grinding machine for SiC
Company information
Our company is engaged in the design, manufacturing, and system development of silicon and compound semiconductors, glass processing, various specialized machines for the aerospace and automotive industries, and precision equipment. We have a well-equipped factory infrastructure. With a factory height of 9 meters and a 7.5-ton crane, we have ample space for the assembly of large equipment. Additionally, we handle precision machining finishing and three-dimensional inspections in-house in a temperature-controlled room. Currently, we are developing a mass production device for vertical glass polishing. We have a track record of selling CNC centers for glass grinding. If you are interested, please feel free to contact us. As a manufacturer of various specialized machines and equipment, we will continue to strive for further evolution. If you have any inquiries or questions, please do not hesitate to reach out. 【Some Achievements】 Semiconductor-related: Polishing machines, cutting machines, and measuring machines with over 80% global market share. Automotive-related: Automatic press-in machines, large cutting machines. Industrial-related: Powder coating machines, various slings, power control units, touch panel boxes. Aerospace-related: Specialized tube cutting machines, inspection benches, etc.