AOCジャパン List of Products and Services

We offer laser processing machines for films and resin substrates equipped with laser oscillators that cover a wide range of pulse widths and wavelengths, from nanoseconds to picoseconds and femtoseconds. Our unique trepanning head allows for high aspect ratio drilling at 1:50, and we can accommodate various substrate and film processing needs, including cutting, marking, and thin film removal. Based on the results of sample processing, we will provide proposals considering your budget and target takt time. 【Features】 ■ Improves productivity and yield with precision and high-speed cutting for FPCs and PCBs used in semiconductor mounting. ■ Capable of supporting dual head configurations and automatic transport and discharge functions. ■ Rapid maintenance and support system unique to our Japanese corporation. *For more details, please view the materials by clicking the "Download Catalog" button. For sample processing inquiries, feel free to contact us through the "Contact Us" section.

• Other processing machines

MOPA fiber lasers are available in a lineup from 20W models to a maximum of 1kW. The pulse width is step-variable from 2ns to 500ns. High-quality beam.

• Laser marker

Q-switched fiber laser oscillators are mainly optimal for marking applications on metals.

• Laser marker

The UV nanosecond pulse laser oscillator has IP65-rated waterproof and dustproof features, making it ideal for laser marking applications in food factories. It has a power output of 5W at 30kHz, providing sufficient output as a UV laser marker. The repetition frequency can reach up to 300kHz, allowing for high-speed printing as well.

• Laser marker

The "DCS Series" is a laser fine processing machine equipped with wavelengths, pulse widths, and output energy that can precisely cut, shape, slice, and mark CVD diamonds. It is utilized in countries around the world, with over 1,000 units installed. It is used in processes such as tool edge processing and the precise polishing of semiconductor wafers. 【Examples of Applications】 ■ Tool edge processing ■ 4P diamond three-dimensional shape processing ■ Internal marking ■ Polishing of diamond wafers *For more details, please refer to the materials available for download in the catalog. We are also accepting inquiries for sample processing. Feel free to contact us.

• Other processing machines

Our company offers a "Glass Micro Hole Drilling Machine (Through Glass Vias)" that can create fine straight holes in glass, silicon, and ceramics. It supports high aspect ratio hole processing with a minimum diameter of 10μm, and we have delivered over 100 units. Based on our expertise in laser cutting and processing technology, we can also propose etching solutions tailored to specific applications. 【Features】 ■ High-precision processing with a minimum hole diameter of 10μm ■ Capable of straight hole processing with a maximum aspect ratio of 1:50 ■ Compatible with processing glass, silicon, and ceramics ■ Contributes to the performance improvement of semiconductor chips and GPUs *We are currently accepting sample processing requests. If you are interested, please apply through the <Contact Us> section. You can also view materials from <Download Catalog>.

• Other processing machines

Lineup of IR/GR/UV wavelengths. Utilizes uniquely developed SESAM laser, ideal for pulse-on-demand options and compact-sized marking units.

• Laser marker

This is a UV laser oscillator for production lines equipped with automatic alignment function, on-demand crystal shift, and real-time power monitoring capabilities. It features a long-life design based on proprietary technology. It is ideal for FCB/PCB and wafer processing. Please consult us for sample processing.

• Laser marker

Widely applicable in semiconductor inspection, spectroscopy, fluorescence analysis, and microfabrication.

• Laser marker

Optimized for embedded use, high cost performance UV 5W, GR 8W, IR 10W @ 100KHz 50-500kHz Options Pulse on demand Analog voltage output control

• Laser marker

The water-cooled compact series of GUI software control is ideal for production lines. Crystal shift (on-demand) and automatic alignment functions can be performed via software. Additionally, real-time output monitoring is possible with the built-in photodiode.

• Laser marker

High-quality finishing achieved through femtosecond pulse laser processing.

• Special Processing Machinery

We can propose precision processing equipment tailored to your needs, such as coaxial observation, ultra-precision stages, and dedicated optical systems for drilling, on a multifunctional platform.

• Wafer processing/polishing equipment

We will integrate your desired laser processing optical system into a compact platform.

• Wafer processing/polishing equipment

We will integrate various lasers and optical systems into a Class 1 compliant safety enclosure according to the application. We can provide proposals while confirming the laser oscillator type and precision requirements through sample processing.

• Wafer processing/polishing equipment

Compatible with pulse-on-demand 1030nm: 5W-30W 515nm: 5W-30W 343nm: 5W-30W

• Wafer processing/polishing equipment

Supports pulse-on-demand. Burst mode standard equipment M2 <1.3 Laser power control Real-time power monitoring

• Wafer processing/polishing equipment

We have a variety of models available at 266nm, 355nm, 532nm, and 1064nm. RS232 control and internal/external trigger control are possible. The 355nm intelligent model and the 266nm model are equipped with a crystal index function that can be executed on demand, enabling recovery from power down and reducing risks in production environments. They are used in many production sites due to their stable power and high-quality beams.

• Wafer processing/polishing equipment

Our company offers solutions tailored to materials and purposes, and "laser processing equipment" is used across various industrial fields. In electronics products, we contribute to new product development through the technical curiosity and efforts of various laser models and application engineers. In semiconductors, our equipment excels in applications across diverse manufacturing processes. Additionally, it is used in PCB and metal processing, new energy, minimally invasive laser microprocessing, and high-quality laser marking for medical devices. Please feel free to contact us if you have any inquiries. 【Fields (partial)】 ■ PCB ■ Electronics products ■ Semiconductors ■ Metal processing ■ New energy * You can download the English version of the catalog. * For more details, please feel free to contact us.

• Other processing machines