Hole diameter from 10μm. Supports hole processing at 1:50 ratio, contributing to the performance improvement of semiconductor chips and GPUs. Sample processing is currently being accepted.
Our company offers a "Glass Micro Hole Drilling Machine (Through Glass Vias)" that can create fine straight holes in glass, silicon, and ceramics. It supports high aspect ratio hole processing with a minimum diameter of 10μm, and we have delivered over 100 units. Based on our expertise in laser cutting and processing technology, we can also propose etching solutions tailored to specific applications. 【Features】 ■ High-precision processing with a minimum hole diameter of 10μm ■ Capable of straight hole processing with a maximum aspect ratio of 1:50 ■ Compatible with processing glass, silicon, and ceramics ■ Contributes to the performance improvement of semiconductor chips and GPUs *We are currently accepting sample processing requests. If you are interested, please apply through the <Contact Us> section. You can also view materials from <Download Catalog>.
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We respond to such needs in semiconductor chip and GPU manufacturing: ◎ Want to improve heat dissipation and signal transmission efficiency ◎ Want to reduce packaging size ◎ Want to control the passage and direction of light *For more details, please refer to the materials. Feel free to contact us.
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*For more details, please refer to the materials. Feel free to contact us as well.*
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Our company handles "industrial laser oscillators" with a proven track record in 24-hour operational production lines. We offer a lineup of LD-pumped solid lasers with nanosecond pulses ranging from 266nm to 1064nm, as well as various picosecond and femtosecond pulse lasers. Additionally, we provide "laser micro-processing machines" equipped with high-precision motion control, such as medical stent processing devices, and "laser marking machines" that can accommodate LD-pumped solid lasers of various wavelengths on a versatile platform. Please feel free to contact us if you have any inquiries.