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  6. LIDE Vitrion Series by LPKF

LIDE Vitrion Series by LPKF

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LIDE Vitrion Series by LPKF

last updated:Aug 17, 2026

BRUX JAPAN CO., LTD Fukuoka Head Office / Tokyo Office
BRUX JAPAN CO., LTD Fukuoka Head Office / Tokyo Office
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TGV Glass Microfabrication Technology LIDE (Laser Induced Deep Etching)

Are you having trouble with the difficult micro-drilling of glass when manufacturing glass core substrates or TGVs? The micro-drilling of glass using LIDE technology = LIDE method allows for the generation of holes through a laser modification followed by an etching process, achieving a safe method without micro-cracks or chipping. If you are hesitant to purchase equipment, we also offer contract processing services, so please feel free to contact us.

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id="product-main-img"

LIDE Vitrion Series by LPKF

  • Related Link - https://www.lpkf.com/jp/industries-technologies/th…

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basic information

Device name: LPKF Vitrion M 5000 Gen2 Maximum processing glass size: 510mm x 515mm Maximum glass thickness: t1.1mm (before etching treatment) Processable shapes: round holes, square holes, step processing, etc. Target materials: general transparent glass

Price information

Separate consultation.

Delivery Time

Please contact us for details

Applications/Examples of results

TGV Core substrate Cavity processing Predice processing etc.

Detailed information

  • LIDE_0000.jpg

    Device appearance

  • LIDE_0002.jpg

    Glass processing process image

  • LIDE_0003.jpg

    The narrow pitch, high-density TGV array clearly demonstrates the high positional accuracy and precision of the LIDE process, achieving high roundness without defects such as cracks.

  • LIDE_0004.jpg

    Cutting surface of the TGV's high-density pattern. A typical hourglass shape. The smoothness of the TGV wall enhances the adhesion between metal and glass.

  • LIDE_0005.jpg

    Manual loading image. There are also devices that can connect to the EFEM.

  • LIDE_0006.jpg

    LIDE processing example

  • LIDE_0007.jpg

    LIDE processing example

  • LIDE_0008.jpg

    Processing examples (half cuts are also possible)

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Model number overview
LPKF Virtion M 5000 Gen2

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LIDE Technology

LIDE Technology

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Invitation to Exhibit at the Microwave Exhibition 2025

  • Company news

Microwave Exhibition 2025 Exhibition Overview 【Dates】November 26 (Wednesday) - 28 (Friday), 2025, 10:00-17:00 【Venue】Pacifico Yokohama Exhibition Hall 【Our Booth】Exhibition Hall D M-08 ■ Products from LPKF Laser & Electronics ■ 【Exhibits】 - High-frequency application circuit board processing machine "LPKF ProtoMat S104" A specialist for high-frequency and microwave applications. It is equipped with all the functions necessary for PCB prototyping. - LPKF glass micro-processing LIDE technology "Vitrion series" processing samples Micro-hole drilling of glass using LIDE technology = The LIDE method modifies the glass with a laser and then generates holes through an etching process, achieving a safe method without micro-cracks or chipping. Please click the related link below for pre-registration ☟ *Pre-registration is required for attendance. Feel free to reach out for technical consultations. We sincerely look forward to your visit. October 2025 Brooks Japan Co., Ltd. Contact: Toyama, Isobe

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BRUX

BRUX JAPAN CO., LTD Fukuoka Head Office / Tokyo Office

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Our company name, BRUX, is derived from the German word "Bruecke," which means "bridge." As the name suggests, we strive to be a bridge connecting technology between Japan and the world, leveraging our extensive experience in international trade and the technical support we continuously accumulate to be of service to everyone.

Product/Service List (35)

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