Fujikura Company Profile

Notice of Participation in CEATEC 2025 October 14 (Tuesday) - 17 (Friday), 2025 | Makuhari Messe Hall 3, Booth No. 3H212 The theme is "Connecting Technologies TM to Create the Future of the Earth - Towards Advanced Digitalization and a Sustainable Society." We will introduce Fujikura's challenges from two perspectives: "Advanced Digitalization" and "Sustainable Society," showcasing how our technologies are used, where they are applied, and how they contribute to solving social issues and transforming industrial structures. ■ The following products are scheduled to be exhibited from the Electronic Components and Connectors Division: 【Ultra-Fine Coaxial Cable Assembly】 Ultra-fine coaxial cable assembly / MCX assembly with 2-axis hinge / MCX assembly for gimbal 【HDD Actuator】 HDD actuator 【Heat Dissipation Solutions】 Cold plate / Heat pipe module / Heat pipe experience 【Eco-Flex Circuits (Membrane)】 Touch-type trackball mouse / Stretchable membrane circuit / Pressure sensors / Capacitive surface pressure sensors / Press area heater / 8-direction pressure switch We invite you to visit our booth.

Pioneering the CASE era with a high-speed, high-reliability interface. The FFMS1 connector is a one-touch lock FPC connector equipped with a "one-action" locking mechanism, suitable for a wide range of applications including in-vehicle internal wiring, communication devices, and industrial equipment. It adopts our unique one-action structure that ensures a secure fit simply by inserting the FPC. This significantly reduces the labor required by customers and enables the complete automation of the FPC insertion process.

To address heat dissipation due to the high performance and high density of CPUs/GPUs in data centers, and to meet a wide range of requests, we have developed a vapor chamber (VC) heat spreader. The heat spreader is a component that efficiently diffuses and dissipates heat generated from semiconductor chips. It is attached to the chip surface and optimizes heat transfer to cooling devices such as heat sinks and liquid cooling systems, playing a role in suppressing the temperature rise of the chip. Typically made from highly thermally conductive metals like copper or aluminum and having a flat shape, this product incorporates a porous body (wick) utilizing capillary action inside a hollow metal plate and adopts a flat heat pipe structure filled with a working fluid.