Fujikura List of News Articles

Starting in May 2025, we began mass production of the "AT7 Series," a gauge pressure high-precision sensor that is among the smallest in the world. The "AT7 Series" is a semiconductor pressure sensor in an ultra-compact 4×4mm package that supports high-resolution digital signal output. The miniaturization of the package and the use of folded leads have achieved space-saving, reducing the mounting area by over 72% compared to our conventional products. It can output a digital signal with an accuracy of ±1.5% FS at temperatures ranging from 0 to +85°C, making it suitable for a wide range of applications, including electrical equipment, medical devices, and industrial equipment. Check out the special site at the related link below!

Notice of Participation in CEATEC 2025 October 14 (Tuesday) - 17 (Friday), 2025 | Makuhari Messe Hall 3, Booth No. 3H212 The theme is "Connecting Technologies TM to Create the Future of the Earth - Towards Advanced Digitalization and a Sustainable Society." We will introduce Fujikura's challenges from two perspectives: "Advanced Digitalization" and "Sustainable Society," showcasing how our technologies are used, where they are applied, and how they contribute to solving social issues and transforming industrial structures. ■ The following products are scheduled to be exhibited from the Electronic Components and Connectors Division: 【Ultra-Fine Coaxial Cable Assembly】 Ultra-fine coaxial cable assembly / MCX assembly with 2-axis hinge / MCX assembly for gimbal 【HDD Actuator】 HDD actuator 【Heat Dissipation Solutions】 Cold plate / Heat pipe module / Heat pipe experience 【Eco-Flex Circuits (Membrane)】 Touch-type trackball mouse / Stretchable membrane circuit / Pressure sensors / Capacitive surface pressure sensors / Press area heater / 8-direction pressure switch We invite you to visit our booth.

Pioneering the CASE era with a high-speed, high-reliability interface. The FFMS1 connector is a one-touch lock FPC connector equipped with a "one-action" locking mechanism, suitable for a wide range of applications including in-vehicle internal wiring, communication devices, and industrial equipment. It adopts our unique one-action structure that ensures a secure fit simply by inserting the FPC. This significantly reduces the labor required by customers and enables the complete automation of the FPC insertion process.

To address heat dissipation due to the high performance and high density of CPUs/GPUs in data centers, and to meet a wide range of requests, we have developed a vapor chamber (VC) heat spreader. The heat spreader is a component that efficiently diffuses and dissipates heat generated from semiconductor chips. It is attached to the chip surface and optimizes heat transfer to cooling devices such as heat sinks and liquid cooling systems, playing a role in suppressing the temperature rise of the chip. Typically made from highly thermally conductive metals like copper or aluminum and having a flat shape, this product incorporates a porous body (wick) utilizing capillary action inside a hollow metal plate and adopts a flat heat pipe structure filled with a working fluid.

The CM08 series is a compact round waterproof connector developed for connecting various sensors. By adopting a diameter of 10mm for the M8 screw fitting size and an integrated molded structure, it achieves a smart and compact shape. Using the CM08 series enables a reduction in wiring work and the miniaturization of equipment.

Our company has developed a cable-type piezoelectric sensor by utilizing the design and manufacturing technology of ultra-fine coaxial cables. The cable-type piezoelectric sensor has a cable shape and responds to physical deformation, allowing it to detect various movements such as vibration, impact, bending, stretching, and strain along its entire length. With an outer diameter of just 0.5mm, it is extremely thin, flexible, and lightweight. It does not require power supply and features a coaxial structure, making it highly resistant to noise.

Our company has developed a tower-type vapor chamber for air cooling to address heat dissipation issues caused by the high performance and high density of CPUs/GPUs in data centers, as well as to meet a wide range of customer demands. The tower-type vapor chamber integrates a cylindrical pipe on top of a typical flat vapor chamber, creating a structure that connects the internal space, with heat dissipation fins attached to the cylindrical section. This developed product achieves a 15% reduction in thermal resistance compared to conventional tower-type air cooling units that combine copper plates and heat pipes, and it is an air-cooled solution that can be used in existing data centers without water cooling facilities, achieving performance improvements comparable to water-cooled cooling effects.

Our company received the Excellence Award at the 38th Electronics Spring Conference, hosted by the Japan Society of Electronics Packaging. This award is given for outstanding academic and technical presentations and papers at the conference. In this award, the application of vacuum and pressure forming methods, as well as transfer printing techniques, was recognized for enabling the formation of three-dimensional and multilayer circuits with tail wiring for connection to external terminals on thermoplastic resins such as ABS and polycarbonate.

The CM03A connector is a waterproof connector compatible with the DeviceNet standard Mini-style. It allows for the interconnection of PLCs from different manufacturers and various field devices (displays, solenoid valves, inverters, I/O terminals, operation terminals, robots, NC, etc.). The conventional CM03A uses soldering for wiring, which requires a significant amount of time for the wiring process. Focusing on reducing this work time, we have developed a crimp-type connector and contacts.

We have developed an ultra-compact Board to Board connector that pursues miniaturization with a mating height of 0.5mm, signal contact pitch of 0.30mm, width of 1.55mm, and a length of pitch total + 2.48mm. By leveraging our technological capabilities in connector development, we enhance our customers' design flexibility and contribute to the advancement of smart devices. Additionally, this connector reduces volume by approximately 40% compared to conventional products with the same number of pins, contributing to a reduction in environmental impact by decreasing material usage.

With the trend towards smaller and thinner mobile devices, the demand for further miniaturization of FPC connection connectors is increasing. In response to this, we have developed the FFA1W series connector. This product features a terminal pitch of 0.15mm, making it one of the smallest in the industry, and a height of 0.55mm when mated with FPC. Even at this minimal level, our unique locking structure and cable lock mechanism maintain high performance. Furthermore, this product contributes to further miniaturization of wearable devices and similar applications, as the cable lock also serves as a signal connection terminal.