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The "DLP-type 3D sensor" is capable of inspecting the height of BGA components and the warping of disc paper, targeting semiconductors, circuit boards, and large products. We have numerous examples of delivering a complete set of hardware and software that enables 3D measurement using the above sensor. 【Custom Support Examples】 ■ Supports large workpieces of 1m x 1m ■ Supports high-speed measurement of 0.05 seconds (tact) ■ Adds 3D inspection to 2D inspection ■ Supports composite materials of resin and metal with varying brightness ■ Addresses blind spots with multiple projectors ■ Supports products in black color You can download a document summarizing the detailed specifications of the sensor from the link below. Please feel free to check it out.
