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Grant Co., Ltd. Company Profile
Drive the future with creativity and proposals.
Grant Corporation continues to evolve daily as a device manufacturer that responds to the needs of the manufacturing site, with the fusion technology of "Engineering × Electronics" at its core. Our mission goes beyond merely creating machines; we aim to provide essential solutions to our customers' challenges with "creativity" and "proposal power." Our strengths lie in the trinity of "technical capability," "responsiveness," and "proposal power." By handling everything from development, design, manufacturing, startup, to after-sales service in-house, we achieve high quality, short delivery times, and high cost performance, delivering solutions that exceed our customers' expectations. With our headquarters in Mie and a branch in Osaka, we can flexibly respond to projects nationwide. Leveraging our on-site capabilities and sense of speed, we support productivity and quality improvement across various industries (automotive, electronic components, precision machinery, medical, etc.) through the provision of optimal devices. Moving forward, we will continue to challenge ourselves as a trusted partner, pursuing value creation with a forward-looking perspective, and supporting Japanese manufacturing as a company.
Business Activities
Business Activities • Design and manufacturing of labor-saving equipment We provide comprehensive support from concept to production and startup of devices that realize efficiency and automation in production sites using 2D/3D CAD. • Customer Support (CS) service business • Construction of automated assembly lines in collaboration with unmanned transport vehicles (AGVs, etc.) • Consulting business related to the improvement and optimization of manufacturing lines. • Sales of consumables • E-commerce (EC) business Business Areas ▸ Equipment for fine devices Design and manufacturing of precision assembly, transport, and inspection equipment optimized for manufacturing lines handling high-precision parts. ▸ Equipment for electronic devices Comprehensive support from specification review to concept and control for automatic mounting, inspection, and handling equipment for electronic components. ▸ Equipment for automotive devices Custom design of dedicated assembly lines and inspection equipment optimized for each product to meet strict quality requirements. ▸ Equipment for custom devices Full custom-made equipment that fully corresponds to the customer's products and processes, realized from the conceptual stage. * We also provide zero-based conceptual support and technical consulting, from hearing issues related to mechanization to process construction and specification proposals.
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Detailed information
| Company name | Grant Co., Ltd. main office |
|---|---|
| number of employees | 3 |
| Contact address | postalcode 515-0041 Mie/ Matsusaka-shi/ 3330-76 Kamikawa TownView on map TEL：0598-28-2307 |
| Key Partners | Our company has built a track record of transactions with many major manufacturers both domestically and internationally over many years. We have earned the trust of customers in various fields, primarily in the manufacturing industry, including automotive, electronic components, and precision machinery.
■ Domestic
- Panasonic Holdings Corporation
- Panasonic Production Engineering Company, Limited
- Panasonic Automotive Systems Company, Limited
- Panasonic Operational Excellence Company, Limited
- DENSO Corporation
- Nitto Denko Corporation
- Nabtesco Corporation
- NTN Precision Resin Co., Ltd.
- Yamazato Sangyo Co., Ltd.
- NADEX Corporation
- Otsuya Co., Ltd.
- Tamaki Iron Works Co., Ltd.
- Many others
■ International
- Panasonic Automotive Systems Asia Pacific Co., Ltd. (Thailand)
- Panasonic Automotive Systems Reynosa Co., Ltd. (Mexico)
- Many others As a total partner in equipment design and manufacturing, we are a device manufacturer that consistently handles everything from the design to the production, installation, and handover of automation equipment in various fields such as semiconductors, automotive parts, and precision components. Location: Mie Headquarters: 515-0041 Mie Prefecture, Matsusaka City, Kamikawacho 3330-76 Osaka Branch: 515-0041 Osaka Prefecture, Ibaraki City, Nonomiya 2-12-18 |
| Industry | Electronic Components and Semiconductors |
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