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● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS. The NVIDIA Jetson AGX Orin 64GB module, consisting of 2048 NVIDIA CUDA cores and 64 Tensor cores, enables server-class AI inference at low latency on the edge. ● It is a highly expandable fanless system that includes LTE/5G compatible M.2 B-Key x1, storage-compatible M.2 M-Key x1, and Wifi/Bluetooth/GPS compatible M.2 E-Key x1. In terms of communication, the onboard 1x10GbE port provides data speeds of up to 100 billion bits per second, which is ten times faster than the traditional GbE standard. ● It is specially designed to achieve fanless and silent operation to meet the diverse applications required for smart cities and smart agriculture, where cost-effective maintenance and improved reliability are essential. It operates over a wide temperature range of -25°C to 55°C and supports a wide input power range of 9 to 36VDC, allowing for flexible power supply options.
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● The NVIDIA Jetson Orin NX module delivers up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It is equipped with 1 x M.2 E-Key for Wi-Fi/BT and 1 x M.2 M-Key for storage. To ensure sufficient data storage for edge computing, the AIB-MO22/32 and AIB-MN32/42 support external M.2 2242 NVMe with high-speed data transmission capabilities. ● To accommodate various embedded applications, especially in challenging environments such as smart factories, smart cities, and smart transportation, it is adapted to operate in a temperature range of -25°C to 70°C and a wide input power range of 12 to 24 VDC.
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● The NVIDIA Jetson Orin NX module delivers up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It includes one M.2 E-Key for Wi-Fi/BT and one M.2 M-Key for storage. To ensure sufficient data storage for edge computing, the AIE-KO21/31 and AIE-KN31/41 support external M.2 2242 NVMe with high-speed data transmission capabilities. ● To accommodate various embedded applications, especially in challenging environments such as smart factories, smart cities, and smart transportation, it is adapted to operate in a temperature range of -25°C to 70°C and a wide input power range of 12 to 24 VDC.
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● The NVIDIA Jetson AGX Orin module delivers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. The NVIDIA Jetson AGX Orin 64 GB module, consisting of 2048 NVIDIA CUDA cores and 64 Tensor cores, enables server-class AI inference at the edge with low latency. ● It is a highly expandable system with built-in LTE/5G compatible M.2 B-Key x 1, Wifi/BT compatible M.2 E-Key x 1, and storage compatible M.2 M-Key x 1. The onboard network supports 2 or 4 x PSE ports for 2 or 4 x POE cameras. The 1 x 10 GbE port achieves data speeds of up to 100 billion bits per second, which is ten times that of the conventional GbE standard. ● To accommodate various embedded applications, especially in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 70°C and a broad input power range from 9 to 36 VDC.
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● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at low latency on the edge. ● It is a highly expandable system that includes one M.2 B-Key for LTE/5G support, one M.2 M-Key for storage support, and one M.2 E-Key for Wifi/Bluetooth/GPS support. An onboard 1 x 10 GbE port provides network connectivity, achieving data speeds of up to 100 billion bits per second, which is ten times the traditional GbE standard. ● To accommodate various embedded applications, particularly in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 70°C and a broad input power range from 9 to 36 VDC.
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● The NVIDIA Jetson Orin NX module achieves up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It is equipped with 1 x M.2 E-Key for Wi-Fi/BT and 1 x M.2 M-Key for storage. To ensure sufficient data storage for edge computing, it supports external M.2 2242 NVMe with high-speed data transmission capabilities. ● It is adapted to operate in challenging environments for various embedded applications, particularly in smart factories, smart cities, and smart transportation, with an operating temperature range from -25°C to 80°C and a wide input power range from 12 to 24 VDC.
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● The NVIDIA Jetson Orin NX module delivers up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It is equipped with 1 x M.2 E-Key for Wi-Fi/BT and 1 x M.2 M-Key for storage. To ensure sufficient data storage for edge computing, it supports external M.2 2242 NVMe with high-speed data transmission capabilities. ● It is adapted to operate in challenging environments for various embedded applications, particularly in smart factories, smart cities, and smart transportation, with an operating temperature range from -25°C to 80°C and a wide input power range from 12 to 24 VDC.
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● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at the edge with low latency. ● It is a highly expandable platform with built-in LTE/5G compatible M.2 B-Key x 1, Wi-Fi/BT compatible M.2 E-Key x 1, and storage compatible M.2 M-Key x 1. The onboard 2 or 4 x PSE ports support 2 or 4 x POE cameras for networking. The 1 x 10 GbE port achieves data speeds of up to 10 times the traditional GbE standard, reaching up to 10 billion bits per second. ● To accommodate various embedded applications, especially in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 80°C and a broad input power range from 9 to 36 VDC.
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The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at the edge with low latency. The AIB-MX13/23 is a highly expandable platform that includes an LTE/5G compatible M.2 B-Key x1, a storage-compatible M.2 M-Key x1, and a Wifi/Bluetooth/GPS compatible M.2 E-Key x1. It features an onboard 1 x 10 GbE port for networking, achieving data speeds of up to 100 billion bits per second, which is ten times that of the traditional GbE standard. The AIB-MX13/23 is designed to meet the demands of various embedded applications, particularly in harsh environments such as smart factories, smart cities, and smart transportation, with a wide operating temperature range from -25°C to 80°C and a broad input power range from 9 to 36 VDC.
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The AIB-AT series includes the "AIB-AT78" equipped with the NVIDIA Jetson T5000 module and the "AIB-AT68" equipped with the NVIDIA Jetson T4000 module. Both platforms, which adopt the NVIDIA Blackwell GPU architecture, achieve exceptional AI computing density in a compact form factor of 140 mm × 165 mm. This design enables deployment in space-constrained systems such as humanoid robots, autonomous warehouse vehicles, surgical assistance robots, agricultural drones, and equipment inspection robots.
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