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• Equipped with 3x M.2 M-key for AI accelerator cards, significantly improving AI inference performance. • A fanless and robust chassis that withstands harsh environments. • Supports dual POE IP cameras for real-time video streaming. • Out-of-band (OOB) management capabilities necessary for remote maintenance of edge AI systems. • Supports up to 3 M.2 format Axelera inference accelerators. • Planned support for EdgeCortix inference accelerators.
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Aetina offers a variety of small form factor (SFF) modules with a compact architecture, targeting applications that typically require high-performance computing in limited spaces. These SFF modules include mobile PCIe modules (MXM) and M.2 modules, proprietary evaluation expansion kits, and one-stop thermal services. The mobile PCI Express modules (MXM) feature compact commercial off-the-shelf (COTS) solutions. Aetina leverages cutting-edge NVIDIA GPUs and AI ASIC processors to deliver unmatched power efficiency and high-level computing capabilities. This enables the optimization of size, weight, and power (SWaP) for edge AI applications, making them ideal for use in embedded systems that require high performance.
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The AEX-2UA1 NVIDIA MGX Short-Depth edge server, built on a modular architecture, is a single-socket server that integrates Intel Xeon 6700 series processors with performance cores and dual high-performance double-width GPUs equipped with NVIDIA NVLink. It achieves ultimate edge AI computing performance in a compact 2U form factor, offering maximum flexibility and compatibility with currently used or next-generation hardware.
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• Aetina's AI On ARM edge computing platform AIE-KR1B-B1 is equipped with the Rockchip RK3588 and seamlessly integrates with various AI accelerator cards. It offers a wide range of inference performance from 13 TOPS for entry-level applications to 214 TOPS for high-performance edge applications. Designed to meet different AI acceleration needs, it accelerates real-time video analysis and high-precision object detection. Additionally, the AI modules can be easily swapped without redevelopment, reducing time to market. • A cost-effective platform with excellent video processing capabilities Aetina's AIE-KR1B-B1 enables real-time video analysis and is ideal for executing smart security and smart retail applications such as multi-channel monitoring and customer behavior analysis.
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• Enhancing Edge AI with Flexible and Budget-Friendly Solutions Aetina has announced a new ARM edge platform that supports AI acceleration cards, offering a variety of applications and options. There is no need to redevelop to switch AI on ARM edge devices. • Cost-Effective Platform with Excellent Video Processing Capabilities Aetina's AIB-MR1A-B1, equipped with the Rockchip RK3588, enables real-time video analysis and is ideal for executing smart security and smart retail applications such as multi-channel monitoring and customer behavior analysis.
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Aetina combines its unique industrial-grade edge computing technology with Qualcomm's top-tier advanced inference accelerator technology, further providing advanced software and services. • A desktop system that makes enterprise AI projects feasible • Up to 870 TOPS of AI performance, supporting generative AI, machine learning, and computer vision • Real-time analysis with sub-millisecond low latency • Compatible with a wide range of AI frameworks • Achieves excellent performance while maintaining high energy efficiency
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● The NVIDIA Jetson Orin NX module achieves up to 100 TOPS, which is about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano delivers a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson Nano module. ● It is a highly expandable fanless system that includes an M.2 B-Key x1 for LTE/5G support, an M.2 E-Key x1 for Wi-Fi/BT support, and an M.2 M-Key x1 for storage. To address the lack of data storage in edge computing, the AIE-PO22/32 and AIE-PN32/42 support an external 128 GB M.2 2242 NVMe with high-speed data transmission. ● Specially designed to achieve fanless and silent operation, it caters to a variety of applications such as smart cities and smart agriculture, where cost-effective maintenance and improved reliability are required. It operates over a wide temperature range from -25°C to 55°C and supports a broad input power range of 12 to 24 VDC, allowing for flexible power supply options.
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● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS. The NVIDIA Jetson AGX Orin 64GB module, consisting of 2048 NVIDIA CUDA cores and 64 Tensor cores, enables server-class AI inference at the edge with low latency. ● It is a highly expandable fanless system that incorporates LTE/5G compatible M.2 B-Key x1, Wi-Fi/BT compatible M.2 E-Key x1, and storage-compatible M.2 M-Key x1. In terms of communication, the onboard 2 or 4 x PSE ports support 2 or 4 x POE cameras, and the 1x10GbE port achieves a maximum data speed of 100 billion bits per second, which is ten times that of the conventional GbE standard. ● It has been specially designed to achieve fanless and silent operation to cater to diverse applications such as smart cities and smart agriculture, where cost-effective maintenance and improved reliability are required. It operates over a wide temperature range of -25°C to 55°C and supports a wide input power range of 9 to 36VDC, allowing for flexible power supply options.
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● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS. The NVIDIA Jetson AGX Orin 64GB module, consisting of 2048 NVIDIA CUDA cores and 64 Tensor cores, enables server-class AI inference at low latency on the edge. ● It is a highly expandable fanless system that includes LTE/5G compatible M.2 B-Key x1, storage-compatible M.2 M-Key x1, and Wifi/Bluetooth/GPS compatible M.2 E-Key x1. In terms of communication, the onboard 1x10GbE port provides data speeds of up to 100 billion bits per second, which is ten times faster than the traditional GbE standard. ● It is specially designed to achieve fanless and silent operation to meet the diverse applications required for smart cities and smart agriculture, where cost-effective maintenance and improved reliability are essential. It operates over a wide temperature range of -25°C to 55°C and supports a wide input power range of 9 to 36VDC, allowing for flexible power supply options.
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● The NVIDIA Jetson Orin NX module delivers up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It is equipped with 1 x M.2 E-Key for Wi-Fi/BT and 1 x M.2 M-Key for storage. To ensure sufficient data storage for edge computing, the AIB-MO22/32 and AIB-MN32/42 support external M.2 2242 NVMe with high-speed data transmission capabilities. ● To accommodate various embedded applications, especially in challenging environments such as smart factories, smart cities, and smart transportation, it is adapted to operate in a temperature range of -25°C to 70°C and a wide input power range of 12 to 24 VDC.
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● The NVIDIA Jetson Orin NX module delivers up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It includes one M.2 E-Key for Wi-Fi/BT and one M.2 M-Key for storage. To ensure sufficient data storage for edge computing, the AIE-KO21/31 and AIE-KN31/41 support external M.2 2242 NVMe with high-speed data transmission capabilities. ● To accommodate various embedded applications, especially in challenging environments such as smart factories, smart cities, and smart transportation, it is adapted to operate in a temperature range of -25°C to 70°C and a wide input power range of 12 to 24 VDC.
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● The NVIDIA Jetson AGX Orin module delivers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. The NVIDIA Jetson AGX Orin 64 GB module, consisting of 2048 NVIDIA CUDA cores and 64 Tensor cores, enables server-class AI inference at the edge with low latency. ● It is a highly expandable system with built-in LTE/5G compatible M.2 B-Key x 1, Wifi/BT compatible M.2 E-Key x 1, and storage compatible M.2 M-Key x 1. The onboard network supports 2 or 4 x PSE ports for 2 or 4 x POE cameras. The 1 x 10 GbE port achieves data speeds of up to 100 billion bits per second, which is ten times that of the conventional GbE standard. ● To accommodate various embedded applications, especially in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 70°C and a broad input power range from 9 to 36 VDC.
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● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at low latency on the edge. ● It is a highly expandable system that includes one M.2 B-Key for LTE/5G support, one M.2 M-Key for storage support, and one M.2 E-Key for Wifi/Bluetooth/GPS support. An onboard 1 x 10 GbE port provides network connectivity, achieving data speeds of up to 100 billion bits per second, which is ten times the traditional GbE standard. ● To accommodate various embedded applications, particularly in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 70°C and a broad input power range from 9 to 36 VDC.
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● The NVIDIA Jetson Orin NX module achieves up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It is equipped with 1 x M.2 E-Key for Wi-Fi/BT and 1 x M.2 M-Key for storage. To ensure sufficient data storage for edge computing, it supports external M.2 2242 NVMe with high-speed data transmission capabilities. ● It is adapted to operate in challenging environments for various embedded applications, particularly in smart factories, smart cities, and smart transportation, with an operating temperature range from -25°C to 80°C and a wide input power range from 12 to 24 VDC.
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● The NVIDIA Jetson Orin NX module delivers up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It is equipped with 1 x M.2 E-Key for Wi-Fi/BT and 1 x M.2 M-Key for storage. To ensure sufficient data storage for edge computing, it supports external M.2 2242 NVMe with high-speed data transmission capabilities. ● It is adapted to operate in challenging environments for various embedded applications, particularly in smart factories, smart cities, and smart transportation, with an operating temperature range from -25°C to 80°C and a wide input power range from 12 to 24 VDC.
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● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at the edge with low latency. ● It is a highly expandable platform with built-in LTE/5G compatible M.2 B-Key x 1, Wi-Fi/BT compatible M.2 E-Key x 1, and storage compatible M.2 M-Key x 1. The onboard 2 or 4 x PSE ports support 2 or 4 x POE cameras for networking. The 1 x 10 GbE port achieves data speeds of up to 10 times the traditional GbE standard, reaching up to 10 billion bits per second. ● To accommodate various embedded applications, especially in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 80°C and a broad input power range from 9 to 36 VDC.
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The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at the edge with low latency. The AIB-MX13/23 is a highly expandable platform that includes an LTE/5G compatible M.2 B-Key x1, a storage-compatible M.2 M-Key x1, and a Wifi/Bluetooth/GPS compatible M.2 E-Key x1. It features an onboard 1 x 10 GbE port for networking, achieving data speeds of up to 100 billion bits per second, which is ten times that of the traditional GbE standard. The AIB-MX13/23 is designed to meet the demands of various embedded applications, particularly in harsh environments such as smart factories, smart cities, and smart transportation, with a wide operating temperature range from -25°C to 80°C and a broad input power range from 9 to 36 VDC.
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The AIB-AT series includes the "AIB-AT78" equipped with the NVIDIA Jetson T5000 module and the "AIB-AT68" equipped with the NVIDIA Jetson T4000 module. Both platforms, which adopt the NVIDIA Blackwell GPU architecture, achieve exceptional AI computing density in a compact form factor of 140 mm × 165 mm. This design enables deployment in space-constrained systems such as humanoid robots, autonomous warehouse vehicles, surgical assistance robots, agricultural drones, and equipment inspection robots.
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