東京電子工業 List of Products and Services

It is also possible to simultaneously process "composite materials" made of different materials, such as glass and silicon bonding materials, and metal-based resin substrates, so please feel free to consult us. In addition to ceramics and glass materials, which are our specialties, we can also handle ultra-precision processing of crystalline materials, magnetic materials, resins, and metals. With approximately 200 types of diamond tools and the technology and know-how accumulated from our extensive processing experience, we can respond to various processing conditions and perform simultaneous processing. **Six Strengths of Composite Material Processing** ■ Cutting processing of glass and silicon bonding substrates ■ Fine grooving processing of ferrite ■ Cutting processing of thick glass and epoxy substrates ■ Cutting processing of metal-based resin substrates ■ Fine grinding and cutting processing of samarium cobalt ■ Grooving processing of resin materials *For more details, please refer to the PDF document or feel free to contact us.*

• Processing Contract

Glass is a material that is "fragile and prone to dirt," and it is said to be difficult to process, similar to ceramics. Our company specializes in the processing of quartz, crystal, and other glass materials. We respond to our customers' diverse needs with meticulous and speedy service, including glass processing, the processing of glass pipes and laminated glass, and delivery in a clean state. 【Six Strengths of Glass Processing】 ■ Cutting processing of patterned glass ■ Cutting processing of thick materials ■ Grooving processing ■ Cutting processing of long materials ■ High-precision cutting processing of high-hardness materials ■ Cutting processing of filter glass *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Ceramics are a typical difficult material characterized as "hard and brittle." As a material, they excel in strength and heat resistance, have high corrosion resistance, and are indispensable in the semiconductor manufacturing process. Tokyo Electron Industries has achieved high-precision cutting of patterned materials and high-precision processing of thick ceramics. We respond to our customers' advanced requests with uncompromising finishes, eliminating chipping and cracking during cutting and minimizing surface burrs. **Six Strengths of Ceramic Processing** - Supports consistent processing from blocks to individual pieces - Achieves high-precision processing of thick materials - Minimizes surface burrs - Extensive processing experience with high-hardness materials - Cost reduction through automation - Capable of processing various shapes *For more details, please refer to the PDF materials or feel free to contact us.*

• Processing Contract

Tokyo Electronic Industry has its own factories in Todak and Kasukabe, Saitama Prefecture. In recent years, it has specialized in the cutting and processing of ceramics and glass, enhancing its equipment and systems, including dicing machines, slicing machines, and clean rooms (at the headquarters factory), to support customers' advanced specifications, production quantities, and shortened delivery schedules. The headquarters factory focuses on a variety of products, while the Kasukabe factory specializes in mass production, thereby increasing production efficiency. 【Features】 ■ Over 100,000 cutting case studies at the headquarters and Kasukabe factories ■ Accumulated technology and know-how in ultra-precision processing and ultra-fine processing ■ Introduction of new equipment to meet the increasingly demanding customer requests ■ Establishment of a production system that integrates rich experience, processing equipment, and high technical capabilities ■ Ownership of approximately 100 processing machines to meet the needs for ultra-precision and fine processing *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract

"Grinding processing" is a technique that simultaneously applies fine particles called abrasives, which have high hardness, to shave the surface of a material in small amounts, resulting in a smooth finish. Diamond is sometimes used as the abrasive material, allowing for adjustments at the micron level. This technique is employed for products that require precision and strength. Since it can reduce surface irregularities and achieve a glossy finish, grinding processing is also performed for the purpose of enhancing appearance and aesthetics, as well as for pre-treatment before surface processing. 【Features】 ■ Simultaneously applies fine particles called abrasives with high hardness ■ Shaves the surface of the material in small amounts to achieve a smooth finish ■ Diamond may be used as the abrasive material ■ Allows for adjustments at the micron level ■ Used for products that require precision and strength *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

"Grinding processing" is a method that literally removes material from the workpiece using high-speed rotating diamond wheels or grinding stones. It is used to shave off the thickness and edges of materials with high hardness, as well as for finishing processes to improve surface flatness. "Grooving processing" allows for high-precision grooving (step processing) on plate-shaped workpieces. It can accommodate various types of materials such as ceramics and glass. With the machining precision of Tokyo Electron Industry, we respond to our customers' high-difficulty specification requirements that they envision. 【Features】 <Grinding Processing> ■ Removes thickness and edges of materials with high hardness ■ Also used for finishing processes to improve surface flatness <Grooving Processing> ■ Accommodates various types of materials such as ceramics and glass ■ Contributes to reducing the number of parts and processes *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract

"Dicing processing" involves cutting materials such as ceramics and glass into dice-shaped pieces or creating grooves using a high-speed rotating diamond blade. Chips with individual functions are separated according to the patterns created on semiconductor wafers and substrates. Dicing processing is performed using a dicing machine and appropriate blades tailored to the characteristics of the material and the specifications of the product. The processing position of the material can be recognized on the device, allowing for the cutting of patterned materials. Furthermore, with the ability to read patterns through image recognition, high-precision processing can be achieved while assessing any deformation of the material. **Strengths of Tokyo Electron Industry** - Achieves high precision, high quality, and high yield - Expertise in diamond tools and processing methods - Supports from a minimum of one piece, in-house prototype and mass production - Urgent requests can also be accommodated with a fully integrated in-house system *For more details, please refer to the PDF document or feel free to contact us.*

• Processing Contract

Our company specializes in ultra-precision machining of difficult materials such as ceramics, glass, and composites. We receive requests from a wide range of customers, including semiconductor, telecommunications, IoT, medical, automotive, and aerospace manufacturers, with over 100,000 machining achievements. Whether for prototypes or mass production, we respond to our customers' high-level demands with quality and speed. 【Features】 ■ Advanced technology: Over 100,000 machining cases ■ Difficult materials: Ceramics, glass, composites ■ Ultra-precision: Width 2μm, depth 150μm, pitch 40μm ■ Capability: Short delivery times, proposal ability, mass production of 500 million units/year, 100 machines in our own factory *For more details, please download the PDF or feel free to contact us.

• Processing Contract
• Ceramics
• Glass

We perform ultra-precision and ultra-fine processing of patterned ceramic, glass, composite materials, etc., from prototyping to mass production.

• Printed Circuit Board
• Other electronic parts
• Other processing machines

Ceramics are generally considered difficult materials to process due to their hard and brittle characteristics. Our company can offer a wide variety of processing options tailored to your ceramic processing needs.

• Printed Circuit Board
• Other electronic parts
• Other processing machines

Due to its characteristics of being easily breakable and prone to getting dirty, glass is generally considered a difficult material to process. Our company can offer a wide variety of processing options tailored to your glass processing needs.

• Printed Circuit Board
• Other electronic parts
• Other processing machines