イングスシナノ List of Products and Services

At Ings Shinano, we are working on the development of die bonding implementation for small semiconductor devices. We have made it possible to mount small chips down to 0.1mm.

• LED Module

Ings Shinano Co., Ltd. leverages the strengths of the regional business network to responsibly respond to various requests. By providing specifications and drawings, we will consistently handle everything from circuit board design, procurement of necessary materials, assembly, rework/repair, quality evaluation, to packaging/shipping, thereby eliminating the troublesome tasks for our customers. We accommodate from single units to mass production. Based on the I-JIT philosophy, we will respond 100% to your requests. 【Business Activities (Excerpt)】 ■ Manufacturing of color LCD display modules for smartphones, tablets, and other devices Including driver IC mounting, FPC mounting, touch panel, and cover glass attachment, etc. ■ Assembly, inspection, and shipping of TFT panel modules for LCD projectors ■ Manufacturing of digital camera-related equipment and optical-related equipment ■ Wire bonding, ACF, COB, COF, FCB, etc. Bare chip mounting, prototyping, mass production contracting, and mounting evaluation ■ Manufacturing of hermetically sealed packages using seam welding and conducting leak tests and evaluations, etc. *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing
• Circuit board design and manufacturing
• LCD display

We accept prototype and small-lot mass production of "bare chips, LEDs, and MEMS." Wire bonding can be handled from a single substrate and a single wire to anything. ACF procurement is also possible. In addition, for various implementations of bare chips, we also support modularization and rework/repair. For more details, please contact us. 【Our Process】 <Implementation> ■ Substrate design ■ Procurement of substrate and other necessary materials ■ Implementation ■ Assembly ■ Quality evaluation/inspection ■ Packaging/shipping *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing
• Circuit board design and manufacturing
• Other mounting machines

We have a seam welding machine for MEMS packages, providing services for prototypes and mass production that require airtight sealing, such as MEMS. If you provide us with specifications or drawings, we will handle everything from package design and material procurement to assembly and shipping in a consistent manner. Our assembly capabilities include wire bonding, ACF (Anisotropic Conductive Film), FCB (Flip Chip Bonding), and SMT (Surface Mount Technology). 【Semi-Automatic Vacuum Seam Welding Machine Specifications】 ■ Compatible Package Size: 2.0 mm to 60 mm ■ Sealing Pressure: Atmospheric pressure to high vacuum (below 5×10^-3 Pa) ■ Sealing Gas: N2 (other gases available upon consultation) ■ Supports MEMS prototypes and small-scale production *For more details, please refer to the catalog or feel free to contact us.

• Contract manufacturing
• Other mounting machines
• Prototype Services

"Implementation" is a service that consistently handles board design, material procurement, mounting, assembly, quality evaluation/assurance, and packaging/shipping for bare chip mounting such as wire bonding, ACF, FCB, and SMT. We are capable of supporting prototyping and small-scale production (up to tens of thousands of units per month), as well as dicing of IC chips, tray transfer, back grinding, and modularization. We also accept rework/repair starting from a single wire, so please feel free to contact us. 【Wire Bonding】 ■ Gold wire bonding ■ Aluminum fine wire/thick wire wedge bonding ■ Gold and aluminum ribbon bonding ■ Copper wire bonding ■ Ribbon bonding *For more details, please refer to the catalog or feel free to contact us.

• Contract manufacturing
• Other mounting machines
• Prototype Services

The "Quality Evaluation Test" is a service that conducts various tests and evaluations under constant temperature and humidity conditions, including implementation strength measurement, positional accuracy measurement, and reliability assessment. We are available 24 hours a day, 365 days a year, and if you consult with us, we can suggest testing methods and more. We also offer rental of evaluation equipment, so please feel free to contact us. [Test Contents] ■ Humidity Testing ■ Non-destructive Testing ■ Precision Dimensional Measurement ■ Strength Testing *For more details, please refer to the catalog or feel free to contact us.

• Other services
• Contract Inspection

"Flat panel display" is a service that can consistently handle panel design, panel procurement, lamination, implementation, and inspection. Since we can handle both prototyping and mass production, we can accept orders starting from just one panel and also respond to short delivery times. We also accept modularization after lamination, so please feel free to contact us. 【Target Panels】 ■ LCD Panels ■ OLED (Organic EL) ■ Touch Panels ■ Electronic Paper *For more details, please refer to the catalog or feel free to contact us.

• LCD display
• Other FPD related
• Organic EL

Introducing the flip chip bonder from Ings Shinano. We can accommodate orders starting from just one flip chip with a short delivery time! We also accept prototypes and mass production! Please feel free to consult with us first!

• Semiconductor inspection/test equipment

We specialize in wire bonding assembly of bare chips such as LEDs and driver ICs. (Epoxy die bonding assembly of bare chips is also possible.)

• Contract manufacturing

We accept prototypes for applications using ACF (Anisotropic Conductive Film) for connecting glass substrates (panels) and FPC, as well as for alternatives to connectors and solder, such as connector-less connections between FPCs using ACF and ACF connections between narrow-pitch connectors and substrates that are difficult to achieve with solder, including COG (Chip On Glass) and COF (Chip On FPC).

• Contract manufacturing