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We would like to introduce the flux application and rust prevention treatment for finishing processes handled by Fujikiko Co., Ltd. With optimal conveyor design and nozzle design, uniform treatment without unevenness is possible. Compatible with processing chemicals from various chemical manufacturers. 【Features】 ■ Compatible with processing chemicals from various chemical manufacturers ■ Optimal conveyor design and nozzle design ■ Uniform treatment without unevenness is possible *For more details, please refer to the PDF materials or feel free to contact us.
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Free membership registrationWe would like to introduce the solder resist development for finishing treatment handled by Fujikiko Co., Ltd. It accommodates everything from single-sided PCBs to flexible PCBs using Roll to Roll. Additionally, due to optimal spray placement, there is no residue left from the resist. 【Features】 ■ Accommodates everything from single-sided PCBs to flexible PCBs using Roll to Roll ■ Optimal spray placement ■ No resist residue left *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationWe would like to introduce the acid treatment and soft etching for surface treatment handled by Fujikiko Co., Ltd. With an optimal nozzle design, uniform processing is possible. Additionally, by optimizing washing and drying, the finish will be free of liquid stains, unevenness, and rust. 【Features】 ■ Uniform processing is possible due to optimal nozzle design ■ Washing and drying are optimized ■ The finish will be free of liquid stains, unevenness, and rust ■ The clean design of the drying equipment prevents dust adhesion *For more details, please refer to the PDF materials or feel free to contact us.
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Free membership registrationIntroducing the surface roughening and blackening treatment machine for surface treatment handled by Fujikiko Co., Ltd. Thanks to the optimal conveyor design and nozzle design, uniform processing without unevenness is possible. Additionally, the clean design of the drying device prevents dust adhesion and is compatible with processing chemicals from various chemical manufacturers. 【Features】 ■ Compatible with processing chemicals from various chemical manufacturers ■ Optimal conveyor design and nozzle design ■ Uniform processing without unevenness is possible ■ Clean design of the drying device prevents dust adhesion *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationIntroducing the desmear machine for plating processes handled by Fujikiko Co., Ltd. It accommodates everything from single-sided PCBs to flexible PCBs using Roll to Roll. With an optimal spray design, it achieves complete smear removal. Additionally, the equipment is designed with maintenance in mind. 【Features】 ■ Accommodates everything from single-sided PCBs to flexible PCBs using Roll to Roll ■ Optimal spray design ■ Achieves complete smear removal ■ Equipment design considering maintenance *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationIntroducing the electroless copper plating for plating processes handled by Fujikiko Co., Ltd. Thanks to optimal spray configuration, uniform plating treatment is possible even inside blind vias and high-aspect ratio through holes. We accommodate everything from single-sided boards to flexible boards using Roll to Roll, and due to horizontal transport processing, automation from input to output is achievable. 【Features】 ■ Compatible with single-sided boards to flexible boards using Roll to Roll ■ Uniform plating treatment possible even inside blind vias and high-aspect ratio through holes due to optimal spray configuration ■ Horizontal transport processing ■ Automation from input to output is achievable *For more details, please refer to the PDF materials or feel free to contact us.
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Free membership registrationIntroducing the peeling device for pattern formation handled by Fujikiko Co., Ltd. It supports everything from sheet substrates to flexible substrates using Roll to Roll. Additionally, thanks to the optimal spray arrangement, there is no residue left from the resist, and it is compatible with organic amine-based peeling solutions. 【Features】 ■ Supports everything from sheet substrates to flexible substrates using Roll to Roll ■ No resist residue left due to the optimal spray arrangement ■ Compatible with organic amine-based peeling solutions *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationWe would like to introduce the etching equipment for pattern formation handled by Fujikiko Co., Ltd. Our vacuum etching technology enables high-precision pattern processing, resulting in minimal variation across the surface. Additionally, we can accommodate everything from fine semiconductor package substrates to thick copper substrates. 【Features】 ■ Supports from sheet substrates to flexible substrates via Roll to Roll ■ Accommodates fine semiconductor package substrates to thick copper substrates ■ Achieves high-precision pattern processing through vacuum etching technology ■ Finishes with minimal variation across the surface *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationIntroducing the developing equipment for pattern formation handled by Fujikiko Co., Ltd. Compatible with both sheet substrates and flexible substrates using Roll to Roll. Thanks to the spray application, there is no scum left behind, and the well-designed horizontal transport conveyor prevents resist collapse. 【Features】 ■ Compatible with both sheet substrates and flexible substrates using Roll to Roll ■ No scum left behind due to spray application ■ Well-designed horizontal transport conveyor ■ No resist collapse occurs *For more details, please refer to the PDF materials or feel free to contact us.
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Free membership registrationThis is a machine for electroless copper plating for substrate manufacturing. With optimal spray configuration, uniform plating can be achieved even inside blind vias and high aspect ratio through holes. Since it operates with horizontal transport, automation is possible from input to output. 【Features】 ◆ Plating is possible without the need for electrical conductivity, even on non-conductive materials. ◆ When combined with our various products, circuit widths can be minimized to 25μm. = For more details, please contact us =
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Free membership registrationThis is a vacuum etching device for substrate creation. Utilizing our proud chip-on-flexible and tape-on-board technology, we can minimize the substrate circuit width to as small as 25μm. 【Features】 ◆ Utilizing industry-leading vacuum etching technology ◆ Through collaboration with our other substrate manufacturing machines, we can minimize the circuit width to 25μm ■□■□■□■□■□■□■□■□■□■□■□■□ ===== For more details, please contact us=====
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