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  6. Electroless copper plating equipment for semiconductor and printed circuit board horizontal manufacturing.

Electroless copper plating equipment for semiconductor and printed circuit board horizontal manufacturing.

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Non-electrolytic copper plating device

last updated:May 07, 2020

フジ機工
フジ機工
  • Official site

Supports everything from single-sided substrates to flexible substrates using Roll to Roll!

This is a machine for electroless copper plating for substrate manufacturing. With optimal spray configuration, uniform plating can be achieved even inside blind vias and high aspect ratio through holes. Since it operates with horizontal transport, automation is possible from input to output. 【Features】 ◆ Plating is possible without the need for electrical conductivity, even on non-conductive materials. ◆ When combined with our various products, circuit widths can be minimized to 25μm. = For more details, please contact us =

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Electroless copper plating equipment for semiconductor and printed circuit board horizontal manufacturing.

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This is a machine for electroless copper plating for substrate manufacturing. 【Features】 ◆ Plating is possible on non-conductors without the need for electrical current. ◆ Can minimize circuit widths down to 25μm when combined with our various products. = For more details, please contact us =

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【Purpose】Electroless copper plating is performed for substrate manufacturing.

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Non-electrolytic copper plating device

Non-electrolytic copper plating device

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フジ機工

フジ機工

Industrial Machinery

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In 1970, the founder and former president believed that an era would come when electrical products would be in high demand, and he focused on printed circuit boards that send electrical signals. He began developing equipment capable of producing printed circuit boards in large quantities and with stability. However, at that time, he had only his unique ideas and determination. He honed his technology and fueled his passion to develop the "horizontal wet process production equipment for printed circuit boards." Since then, the horizontal wet process production equipment has undergone improvements and evolution, expanding its product range to cover all wet processes in the printed circuit board production line, contributing not only in Japan but also in production sites around the world. Moving forward, we will continue to refine our technology and deliver products that meet the demands of customers in various fields, not limited to printed circuit board production equipment. Fujikiko aims to become an excellent company that can meet worldwide expectations as a "top runner in substrate production equipment," with the entire group working together towards this goal.

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