ソフエンジニアリング List of Products and Services

■Suitable for various WET processes such as etching, RCA cleaning, and developing ■Ideal for organic stripping/lift-off processes that do not use ultrasound 　◎Compatible with high-pressure jet and spray treatments 　◎When using ultrasound for effective removal of dry-etch residues and burrs during lift-off, the "Spin Dip Processor" is recommended. ■Full process of chemical solution ⇒ rinse ⇒ drying in a single chamber, supporting Dry-In/Dry-Out 　◎Conventional method: 2-chamber configuration (substrate remains in a chemical solution during transfer between chambers) 　◎New method: UDS type uses a 1-chamber configuration. ■Basic operation of the substrate 　◎ "Upper section... LD of the substrate" ⇒ "Lower section... chemical treatment" ⇒ 　　　　　　　　　　　　⇒ "Middle section... rinse and dry" ⇒ "Upper section... ULD of the substrate" ■The patented isolation plate ensures the concentration of the chemical solution during reuse. 　◎Since there is no dilution from rinse water contamination, the chemical solution can be temperature-controlled and reused. *For more details, please refer to the PDF document or feel free to contact us. Wafer, batch-type cleaning equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, resist stripping equipment, resist coating equipment, cleaning equipment, megasonic, photoresist, photolithography process.

- Suitable for various WET processes such as etching, RCA cleaning, and developing. - A full process of "chemical solution ⇒ rinse ⇒ drying" is handled in a single chamber with Dry-In/Dry-Out. - Conventional method: 2-chamber configuration (the substrate remains in contact with the chemical solution during transfer between chambers). - New method: UDS type uses a 1-chamber configuration. - Basic operation of the substrate: - "Upper section… Substrate LD" ⇒ "Lower section… Chemical treatment" ⇒ - "Middle section… Rinse drying" ⇒ "Upper section… Substrate ULD" - The patented isolation plate ensures the concentration of the chemical solution during reuse. - There is no dilution from rinse water contamination. - For example, it can accommodate "Lower section… SPM treatment" and "Middle section… APM/MS." - The patented isolation plate completely separates and prevents the scattering of chemical gases and mists in the lower treatment section. - Chemical solution/rinse treatment can be performed on the backside of the substrate, ensuring it is contamination-free. - Shortening the manufacturing process significantly increases production efficiency and can greatly reduce cleanroom occupancy area. - A seamless process of etching ⇒ stripping is possible within a single system device. *For more details, please refer to the PDF document or feel free to contact us.*

- Ideal for etching and cleaning processes. - Chemical treatment is done using a spin method, and rinse drying is done using a conveyor method. - Proven track record of high throughput support with W-lane configuration. - Measures against hazardous corrosive gases during etching: ◎ Equipped with front and rear shutters and rollers in the spin chamber. - Features temperature control circulation and reuse function for chemicals, as well as concentrated/diluted separation function for wastewater. - Swing spray function during rinsing can also be installed. - Up and down air knife drying designed to prevent reattachment of rinse water splashes. *For more details, please refer to the PDF document or feel free to contact us. Wafer, batch-type cleaning equipment, coating and developing equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, semiconductors, resist stripping equipment, megasonic, cleaning equipment, resist, photoresist, photolithography process, silicon, scrub cleaning equipment, scrub cleaning, wafer stripping equipment, wafer cleaning equipment, wafer cleaning machine.

■ We recommend the latest model of the UDS spin processor. 　◎ It is positioned as the "OLD" system within our company. 　◎ Please refer to the new UDS spin processor and the new Spin Dip processor. 　◎ All various elemental technologies related to spinning, such as mixing and rotational speed control, have been developed and applied to the new spin processor. ■ Optimal for RCA processing such as SPM, APM, HPM, and DHF. ■ Supports etching processes like ferric chloride and HF/HNO3. ■ Also compatible with lift-off resist stripping. ■ Can build a cost-effective system as a conventional flat Spin single wafer. ■ Ideal for the disposal of chemical waste. ■ Cross-contamination free. 　◎ During SPM processing, mixing of new sulfuric acid and hydrogen peroxide is done directly above the substrate, eliminating the need for a heater. 　◎ During APM processing, DIW is heated directly with water, and NH4OH and H2O2 are mixed in. ■ Optimal for processing Si, SiC, GaN, sapphire, GaAs, LT, etc. ■ Compatible with round substrates as well as square shapes like Cr masks. *For more details, please refer to the PDF document or feel free to contact us.

■ This is a cassette-type batch processing device. ■ Ideal for batch processing compatible with RCA processes such as APM/MS, SPM, HPM, and DHF. ■ Also supports substrate regeneration processes such as organic stripping and Poly-Si regeneration. ■ Proven capability for anisotropic etching such as MEMS. ■ Achievements up to 300mm. ■ Compatible with various drying units including S/D, IPA vapor drying, and hot water lift drying. ◎ The IPA vapor drying features a watermark suppression function. ■ For recent demands of "small quantity and diverse variety," we recommend the latest UDS spin processor as a spin single wafer. ◎ Throughput improvement is achieved by multi-chamber configuration of the UDS chamber. *For more details, please refer to the PDF document or feel free to contact us. Wafer, substrate cleaning equipment, semiconductor manufacturing equipment, semiconductor, resist stripping equipment, megasonic, low-cost, cleaning equipment, automatic cleaning machine, resist, batch cleaning equipment, silicon, etching equipment, RCA cleaning, insulating film, film formation, ceramic, loader unloader.

The device achieves complete separation and reuse of chemical solutions, and is a manual Spin single-wafer processing device capable of handling the full process of chemical treatment ⇒ rinsing ⇒ drying in one spin. It significantly reduces footprint and costs, and is already patented. It can accommodate not only round substrates but also square-shaped substrates. It has a proven track record in various process treatments such as "RCA," "developing," "etching," "cleaning," "stripping," and "lift-off." 【Features】 ■ It is possible to consolidate various chemical treatment processes such as cleaning and etching into a single total system. ■ It can significantly reduce equipment purchase costs and footprint. ■ Since transfer between chambers is unnecessary, it reduces workpiece attachment and detachment, streamlining operations and preventing transport accidents, thereby improving transport reliability. *For more details, please refer to the PDF document or feel free to contact us. Wafer, single-wafer cleaning device, coating and developing device, substrate cleaning device, spin cleaning device, semiconductor manufacturing equipment, semiconductor, resist stripping device, megasonic, cleaning device, resist, photoresist, photolithography process, silicon, scrub cleaning device, scrub cleaning, wafer stripping device, wafer cleaning device, wafer cleaning machine.

■Rich track record in lift-off and organic peeling processes ■Capable of building systems with wide process margins according to various substrate conditions ■Simultaneous mounting of various peeling/lift-off tools possible Tool selection and combined use possible based on substrate conditions (type/process, etc.) ◎<BLT-type ultrasonic><Horn-type ultrasonic><High-pressure jet><Chemical two-fluid><Multi-spray> ■Equipped with <BLT-type ultrasonic> for low-damage, general-purpose substrate ultrasonic processing ◎BLT-type ultrasonic: Frequency = 38KHz, Vibration amplitude = less than 1μ (P-P) ■Capable of mounting ultra-high amplitude <Horn-type ultrasonic> suitable for robust resist peeling/lift-off ◎Horn-type ultrasonic: Frequency = 38KHz, Vibration amplitude = Max 20μ (P-P) ■Conducting highly uniform ultrasonic processing ◎Standing wave irregularities... theoretically impossible (ultrasonic processing with only direct waves) ◎Irregularities within the ultrasonic vibration surface... strong/weak irregularities above the element (strong) and between elements (weak) are resolved by <substrate rotation> and ultrasonic <scan optimization> ■Application development for burr removal and cleaning after polishing has been implemented *For more details, please refer to the PDF document or feel free to contact us.