シスコム（SysCom） List of Products and Services

It provides information on resin reactions that cannot be obtained using conventional lab-scale thermal analysis devices (such as DSC, DMA, and rheometers). By conducting high-sensitivity dielectric analysis (DEA) online and in real-time during the reaction processes of various liquid resins, FRP/CFRP composites, and molding materials, it analyzes material flow, viscosity changes, gelation, degree of curing and crosslinking progress, and reaction termination, thereby offering the development of more appropriate molding conditions and quality control tests for materials. The sensors can be permanently mounted in molds and used in actual processes such as pressing, RTM (VaRTM) molding, and autoclaving for curing and reaction analysis. Compact and cost-effective models (LT-451, LTF-631, LT-439) are available to accommodate fast reactions in just a few seconds as well as long-duration reactions. Additionally, multiple sensors (1ch to 8ch) can be used simultaneously for effective evaluation of molding properties and curing behavior at multiple points. This technology can be applied from material development and quality control to production sites. For more details, please refer to the catalog and materials.

The new product NDS-1000 is a low-cost, high-function dynamic viscoelastic measurement device that uses a piezoelectric actuator as a vibration source and operates on longitudinal vibrations. It can be applied to samples such as prepregs and those containing fillers, which are difficult to measure with conventional rotational vibrations. It simultaneously evaluates "elasticity" and "viscosity" with high precision using micro-sized and small amounts of samples, comparable to the size of a grain of rice. This general-purpose rheometer can be applied from the development to quality control of various industrial materials, biological and food materials, chemical products, gels, paints, and adhesives. There is an increasing track record of deliveries to universities, research institutions, and private sector research and development and quality control applications in pharmaceuticals, cosmetics, food, electronics, and chemicals. It also responds promptly to actual sample testing. Main Features: 1) All-in-one structure with the temperature control unit housed inside the casing. 2) Easy measurement with your own laptop (USB connection). 3) Simple operation from sample setup to measurement. 4) Easy compression, shear, bending, and tensile testing by exchanging test jigs. 5) Easy confirmation of the linear region with the post-measurement Lissajous display. 6) Capable of measuring flexible materials and liquids due to large amplitude. 7) Applicable to small amounts, thin films, and amorphous samples, etc.

Our "Polymer Curing Automatic Measurement Device" analyzes dielectric constant, ionic viscosity, degree of curing, reaction termination, etc., using DEA (dielectric measurement), and visualizes the status of polymer reactions and curing in real-time. By using dielectric measurement sensors suitable for various applications, it is easy to identify the melting characteristics, viscosity behavior, and curing progress of different resin materials. It can be utilized for visualizing resin reactions in actual molding processes such as pressing, ovens, and autoclave molding. 【Features】 ■ Real-time tracking of resin reactions, viscosity, and curing progress ■ Supports reaction monitoring from a few seconds to long durations ■ Multi-point measurement and use of pressure sensors are also possible *We are currently offering materials with examples of utilization in curing behavior testing. Please check from "PDF Download." Feel free to contact us for inquiries.