Trading company/Wholesale

積水マテリアルソリューションズ

EstablishmentApril 1, 2016
capital5000Ten thousand
number of employees286
addressTokyo/Chuo-ku/4-3-6 Nihonbashi Honcho, PMO Shin-Nihonbashi
phone03-6744-5803
last updated：
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積水マテリアルソリューションズ List of Catalogs

1～45 item / All 92 items

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Fiblock NEO | It has become possible to implement fire compartment penetration measures while leaving the PVC sleeve during the pouring of RC walls / ALC walls.

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Heat-dissipating insulating sheet for metal base substrates | Sekisui Chemical Electronics Division

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Liquid Transport Containers Clean Bottle Series | Sekisui Chemical Electronics Field

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Thermosetting waterproof cushioning material Pantel GEL | Sekisui Chemical Electronics Field

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Vibration and shock mitigation solutions EXAGEL/G-Polstar | Sekisui Chemical Electronics Division

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Wearable Use Rubber Band - High-Performance Rubber Band | Sekisui Chemical - Electronics Field

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Compressed Type Conductive Connector Dot Connector Series Lineup | Sekisui Chemical Electronics Division

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Compression-type conductive connector Dot Connector Series | Sekisui Chemical Electronics Division

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Low-Temperature Decomposition Binder Eslec AS TB | Sekisui Chemical Electronics Field

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Low-temperature decomposition resin for paste - Eslec AS M | Sekisui Chemical - Electronics field

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Binder dispersant solution Eslec NK | Sekisui Chemical Electronics Field

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Binder application aqueous solution Eslec KW | Sekisui Chemical Electronics field

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Paste Powder Resin Eslec SV | Sekisui Chemical Electronics Field

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Binder-grade powdered resin Eslec B, K | Sekisui Chemical Electronics field

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Resin core metal-coated microparticles Micro Pearl AU series | Sekisui Chemical Electronics Division

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High-precision uniform plastic microparticles Micropal SP/GS | Sekisui Chemical Electronics Field

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Silicone Thermal Conductive Sheet TIMLIGHT Insulation Series | Sekisui Chemical Electronics Division

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Silicone Thermal Dissipation Sheet TIMLIGHT Soft Series | Sekisui Chemical Electronics Division

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High Thermal Conductivity Heat Dissipation Sheet TIMLIGHT High Thermal Conductivity Series | Sekisui Chemical Electronics Division

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Heat-dissipating wave absorption sheet Pμ series & high thermal conductivity heat-dissipating sheet MANION series | Sekisui Chemical Electronics Division

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Waterproof/Dustproof, Vibration-Proof, Shock-Absorbing Thin Foam XLIM (Exlim) | Sekisui Chemical Electronics Division

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Ultra-fine, high-aspect ratio forming material for inkjet applications | Sekisui Chemical Electronics Division

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1 Liquid Non-Hardening Thermal Grease GA Series | Sekisui Chemical Electronics Division

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2-component room temperature curing heat dissipation grease CGW series | Sekisui Chemical Electronics Division

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RFID ACP EPOWELL CP Series | Sekisui Chemical Electronics Division

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UTG protective resin & μLED encapsulation resin New from Photrek | Sekisui Chemical Electronics Division

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UV (B stage) + moisture-curing adhesive Photorec B | Sekisui Chemical Electronics Field

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UV delay curing type / low permeability adhesive Photorec E & adhesive for liquid crystal panel ODF process Photorec S | Sekisui Chemical Electronics field

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UV-curable adhesive Photorec A | Sekisui Chemical Electronics Division

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Photorec Series: Resin products used for bonding, sealing, and protection of display peripherals and optical components | Sekisui Chemical Electronics Division

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New product supporting 5G/6G communication: Transparent flexible radio wave reflection film (development product) | Sekisui Chemical Electronics Division

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Interlayer Insulation Film, Thermosetting Interlayer Insulation Film NX/NQ | Sekisui Chemical Electronics Division

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During substrate manufacturing, resist surface protection tape, thin film masking tape | Sekisui Chemical, Electronics field

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Single-sided heat-resistant high-adhesion easy-peel UV tape (up to 250°C) SELFA | Sekisui Chemical Electronics Division

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UV release tape SELFA series achieves a new semiconductor process through heat resistance and release technology | Sekisui Chemical Electronics Division

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Heat press protective release film - low outgassing release film | Sekisui Chemical - Electronics field

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Difficult adhesion tape (developed product) FA/FB series | Sekisui Chemical Electronics Division

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Biobased tape: Double-sided tape made using plant-derived materials that enables a reduction in CO2 emissions | Sekisui Chemical, Electronics Division

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Optical Film Protective Tape 6700/6800 Series | Sekisui Chemical Electronics Division

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Conductive Adhesive Tape 7800 Series | Sekisui Chemical Electronics Division

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LCD glass substrate, CMP, HDD substrate polishing cloth double-sided tape | Sekisui Chemical Electronics Division

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Double-sided tape for fixing LCD materials, 3800 series | Sekisui Chemical, Electronics Division

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Function Form Tape Series 5200 Series | Sekisui Chemical Electronics Field

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Oil wipe wet sheets

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Smart Level Catalog

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