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(2) Printed Circuit Board Design
We propose optimal layer configurations and design rules that meet the high-level demands associated with lightweight, thin, and compact multi-layer substrates, IVH substrates, and build-up substrates, while conducting design in parallel with pre-simulation during the early stages of development. Furthermore, by enabling simultaneous parallel design, we can significantly shorten delivery times. Additionally, our company reflects various design know-how and cutting-edge implementation technologies to provide high-quality products. Please feel free to contact us with any questions or inquiries regarding substrate design.