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At the exhibition "Assembly and Mounting Process Technology Exhibition 2024 in Kumamoto," organized by 19 manufacturers of mounting equipment and post-mounting processes, we will hold a free seminar on "Analysis Methods for Defective Boards Using X-ray Equipment." In this seminar, we will introduce X-ray inspection methods, X-ray defect analysis techniques, and methods for identifying the causes of defects. We will also cover defect cases such as "defects caused by bubbles in inner layer vias" and "defects caused by cracks in through-holes." We look forward to your attendance. 【Seminar Content】 We will discuss methods for analyzing defective mounting boards using X-ray equipment, with variations in defect shapes for each case. Many cases can reveal the causes of defects through analysis of defective boards using X-ray images. We aim to introduce the latest X-ray inspection methods, X-ray defect analysis techniques, and methods for identifying the causes of defects. Selected defect cases to be covered include: (1) Defects caused by bubbles in inner layer vias (normal operation when pressure is applied from above the BGA) (2) Defects caused by cracks in through-holes (cracks occur due to thermal expansion in the furnace, leading to defects upon removal from the furnace, which are considered mounting defects).