アイビット Company Profile

At the exhibition "Assembly and Mounting Process Technology Exhibition 2024 in Kumamoto," organized by 19 manufacturers of mounting equipment and post-mounting processes, we will hold a free seminar on "Analysis Methods for Defective Boards Using X-ray Equipment." In this seminar, we will introduce X-ray inspection methods, X-ray defect analysis techniques, and methods for identifying the causes of defects. We will also cover defect cases such as "defects caused by bubbles in inner layer vias" and "defects caused by cracks in through-holes." We look forward to your attendance. 【Seminar Content】 We will discuss methods for analyzing defective mounting boards using X-ray equipment, with variations in defect shapes for each case. Many cases can reveal the causes of defects through analysis of defective boards using X-ray images. We aim to introduce the latest X-ray inspection methods, X-ray defect analysis techniques, and methods for identifying the causes of defects. Selected defect cases to be covered include: (1) Defects caused by bubbles in inner layer vias (normal operation when pressure is applied from above the BGA) (2) Defects caused by cracks in through-holes (cracks occur due to thermal expansion in the furnace, leading to defects upon removal from the furnace, which are considered mounting defects).

Aibit will be exhibiting at the "Implementation and Assembly Process Technology Exhibition 2023" held at the West Japan General Exhibition Center. This exhibition focuses on automation in the later stages of production and will showcase new equipment from major domestic manufacturers. At our booth, we plan to display the 3D X-ray stereo observation device "FX-400tRX," which comes standard with a chip counter function. We sincerely look forward to your visit.

Aibit Co., Ltd. will be exhibiting at the "Implementation and Assembly Process Technology Exhibition 2022 in Nagoya," held at the Nagoya City Small and Medium Enterprise Promotion Hall. This exhibition will clearly showcase key equipment aimed at automation in the context of the current demand for product quality assurance in the implementation and assembly processes. We plan to exhibit the inline X-ray inspection system "ILX-2000," which can inspect bottom-mounted soldered components such as BGA using X-ray stereo technology, as well as the offline X-ray inspection system "FX-300tRX2," which separates the front and back surfaces of printed circuit boards in about 4 to 5 seconds using X-ray stereo technology. We sincerely look forward to your visit.