You can perform board verification on the spot! Verification of soldering conditions using X-rays and combination evaluations are also possible.
"MUSUBI Osaka Labo" is a demo room where equipment from seven companies is gathered, allowing for actual machine displays, substrate verification, and experiments. It is possible to rework BGA and verify the soldering condition using X-ray, as well as to remove the oxide film from the substrate through plasma treatment and verify the soldering condition with X-ray, enabling combined evaluations. Please feel free to contact us when you need assistance. 【Features of the "X-ray Stereo Method" 3D X-ray Inspection Device FX-400tRX】 ■ High magnification imaging with a geometric magnification of 500 times ■ X-ray stereo method ■ Cancels the backside information of BGA Slices the assembled substrate from the top to the bottom into 300 layers using X-ray stereo CT method * For more details, please download the PDF or feel free to contact us.
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