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Written by Mr. Naoki Kunimine, President of Thermal Design Lab Inc. This is a column material reflecting on 45 years of involvement in thermal design, titled "Miscellaneous Stories of Thermal Design." Due to the favorable response from readers, we are distributing the 8th installment (final edition) of the column. 【Content Overview (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the 8th installment, we will focus on the "printed circuit board," which is central to thermal design, and discuss specific implementation methods for thermal countermeasures that can be applied to the board. ■ There are mainly four thermal countermeasures that can be applied to the board ■ Reduce the thermal resistance between components (heat sources) and the board ■ Increase the thermal diffusion capability of the board itself ■ Enhance heat dissipation from the surface of the board ■ Reduce heat absorption from adjacent components *For more details, please refer to the PDF material or feel free to contact us.

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Written by Mr. Naoki Kunimine, President of Thermal Design Lab Inc. This is a column document reflecting on 45 years of involvement in thermal design, titled "A Collection of Thermal Design Stories." Due to the positive feedback from readers, we are distributing the 7th installment of the column. 【Content Summary (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the 7th installment, following the 5th and 6th installments, we will focus on the "printed circuit board," which is central to thermal design, and discuss specific countermeasures. ■ Thermal measures for the circuit board are carried out through "heat source dispersion" and "heat diffusion." ■ Heat source dispersion achieves the same effect as "improving the thermal conductivity of the circuit board." ■ Forming a heat dissipation pattern with copper foil to diffuse heat within the circuit board. *For more details, please refer to the PDF document or feel free to contact us.

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Written by Naoki Kunimine, President of Thermal Design Lab Inc. This is a column material reflecting on 45 years of involvement in thermal design, titled "Miscellaneous Stories of Thermal Design." Due to the positive feedback from readers, we are releasing the sixth installment of the column. 【Content (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the sixth installment, following the fifth, we will focus on the "printed circuit board," which is central to thermal design, and discuss the steps to solve its challenges. ■ Let's estimate the "heat flux" on the printed circuit board. ■ Let's set the "upper target for thermal resistance" at the heat source. ■ Let's determine the direction of heat dissipation measures. *For more details, please refer to the PDF material or feel free to contact us.

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Written by Mr. Naoki Kunimine, President of Thermal Design Lab, Inc. This is a column material reflecting on 45 years of involvement in thermal design, titled "Miscellaneous Stories of Thermal Design." Due to the positive feedback from readers, we are releasing the fifth installment of the column. 【Contents (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the fifth installment, we will focus on the "printed circuit board," which has now become essential to thermal design, and discuss its background and challenges. ■ When heat generation density was mild ■ The effectiveness of printed circuit boards as a thermal pathway ■ Reasons why establishing thermal design methods for printed circuit boards is challenging *For more details, please refer to the PDF document or feel free to contact us.

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Written by Mr. Naoki Kunimine, President of Thermal Design Lab Inc. This is a column material reflecting on 45 years of involvement in thermal design, titled "Miscellaneous Stories of Thermal Design." Due to the positive feedback from readers, we are releasing the fourth installment of the column. 【Content (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the fourth installment, I will share my views on the "true goal" of utilizing thermal fluid simulation. ■ How to eliminate individual differences in analysis modeling ■ How to improve the accuracy of input data for analysis ■ The goal of simulation is not "agreement with actual measurements" *For more details, please refer to the PDF material or feel free to contact us.

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Written by Naoki Kunimine, President of Thermal Design Lab, Inc. This is a column material reflecting on 45 years of involvement in thermal design, titled "Miscellaneous Stories of Thermal Design." Due to the positive feedback from readers, we are releasing the third installment of the column. 【Contents (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the third installment, we will unravel the discrepancies between simulation analysis and actual measurements, which many designers are likely to struggle with. ■ Even for the same product, the results of simulation analysis can vary depending on the analyst. ■ Actual measurement results are not always the true values, and proper measurement requires technique. ■ We must also consider the impact of product variability. *For more details, please refer to the PDF material or feel free to contact us.

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Cosmo Oil Lubricants is focusing on the development and sales of thermal materials, and our unique thermal material products, which apply lubrication development technology, are already being used by many customers. This document provides a detailed introduction to our thermal materials, "Cosmo Thermal Grease" and "Cosmo Thermal Gap Filler." We invite you to read it. [Contents] ■ Examples of TIM applications and selection criteria ■ Cosmo Thermal Grease ■ Cosmo Thermal Gap Filler ■ Appendix *For more details, please refer to the PDF document or feel free to contact us.

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Written by Naoki Kunimine, President of Thermal Design Lab, Inc. This is a column material reflecting on 45 years of involvement in thermal design, titled "Miscellaneous Stories of Thermal Design." Due to the positive feedback from readers, we are releasing the second installment of the column. 【Content (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the second installment, we will look back at thermal design methods from an era without 3D CAD or thermal fluid simulations. ■ Treating temperature as a requirement and establishing countermeasures ■ Utilizing simple methods and diagrams to capture the flow of heat ■ The method of targeting thermal resistance and concretizing countermeasures remains important even in today's era *For more details, please refer to the PDF document or feel free to contact us.

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"Cosmo Thermal Grease" and "Cosmo Thermal Gap Filler" are high-performance thermal pastes. Since they do not use silicone-based materials, there is no concern about contact failure due to low molecular siloxanes. Please choose between grease (non-curing type) and gap filler (curing type) according to your application. "Cosmo Thermal Grease" is a non-curing type thermal paste that can be spread thinly up to several tens of micrometers. It is used in many fields, including computer CPUs, wireless base stations, office multifunction devices, car navigation systems, and home appliances. "Cosmo Thermal Gap Filler" is a curing type thermal paste. The amount applied can be controlled to any desired thickness, resulting in less stress on the components. You can choose between a one-component heat-curing type and a two-component room-temperature curing type. *For more details, please refer to the PDF document or feel free to contact us.

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This document was written by Naoki Kunimine, President of Thermal Design Lab, Inc. It is a column discussing the changes and constants in thermal design over the past 40 years. [Excerpt of Contents] The author first heard the term "thermal design" over 40 years ago. Although it is irregular, from the perspective of someone who has been involved in thermal design for many years, I would like to share my thoughts on thermal design. ■ Characteristics of Heat: It is a familiar phenomenon that can be intuitively predicted, but numerical predictions are difficult. ■ Major Changes Over 40 Years: - Computers have become faster, and thermal fluid simulations have become widespread. - The use of enclosures and circuit boards for heat dissipation has increased, making heat dissipation materials and devices important. - Dynamic thermal design has become necessary. *For more details, please refer to the PDF document or feel free to contact us.

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"Cosmo Thermal Grease" and "Cosmo Thermal Gap Filler" are high-performance thermal materials with excellent heat resistance and high thermal conductivity. Since they do not use silicone-based materials, there is no concern about contact failure due to low molecular siloxane. Please choose between grease and gap filler (hardened type) according to your application. "Cosmo Thermal Grease" is a non-silicone thermal material that can be spread thinly up to several tens of micrometers, reducing thermal resistance. It is used in many fields, including computer CPUs, wireless base stations, office multifunction devices, car navigation systems, and home appliances. "Cosmo Thermal Gap Filler" is a hardened thermal paste. It can be controlled to any thickness, resulting in less stress on components. You can choose between a one-component heat-curing type and a two-component room-temperature curing type. ★ You can download test data comparing thermal effects. ★ You can also download the "Thermal Design Column" written by Naoki Kunimine, the representative director of Thermal Design Lab. *For more details, please refer to the PDF materials or feel free to contact us.

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In relays and switches used in electronic components, contact failure due to low molecular weight siloxanes is a concern. It is said that contact failure caused by low molecular weight siloxanes occurs when unreacted components or degradation products in silicone-based materials gasify and adhere to the relay contacts, and then oxidatively decompose into silicon dioxide (SiO2) due to the energy during relay operation, leading to accumulation. In recent years, as electronic components have become smaller and lighter, the volume of packaging has been decreasing, which has increased the risk of contact failure due to rising gas concentrations. Cosmo's thermal insulation materials do not contain silicone-based substrates, so there is no concern about contact failure due to low molecular weight siloxanes. They can be safely used in compact and high-density mounted electronic components. [Causes of electrical contact failure] - Dust in the air - Corrosion (sulfidation) on silver contacts - High concentration vapors of organic compounds - Vapors in silicone products (low molecular weight siloxanes)

• Lubricants

It can conform to the complex uneven shapes of a wide application area, demonstrating effective thermal conductivity. It can be controlled to any thickness, resulting in minimal stress on the components. After curing, there is no concern about pump-out, just like with sheets. Additionally, since it does not use silicone-based materials, there is no worry about contact failures due to low molecular siloxanes. 【Features】 ■ Non-silicone based (silicone-free) ■ Can conform to the complex uneven shapes of a wide application area, demonstrating effective thermal conductivity ■ Can be controlled to any thickness, resulting in minimal stress on the components ■ After curing, there is no concern about pump-out, just like with sheets ■ Confirmed no increase in thermal resistance in high-temperature durability evaluation tests at 150°C ■ Excellent repairability after curing *For more details, please refer to the PDF document or feel free to contact us.*

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It can be controlled to any thickness, resulting in minimal stress on components, and since it does not use silicone-based materials, there is no concern about contact failure due to low molecular siloxane. As a standard product, we offer the "Cosmo Thermal Gap Filler CGS3501." Additionally, we can customize products according to customer requests, including "adhesive types," "thin film types," "high thermal conductivity types," and "low hardness types." 【Features】 - Non-silicone based (silicone-free) - Can conform to complex uneven shapes over a wide application area, demonstrating effective thermal conductivity. - Can be controlled to any thickness, resulting in minimal stress on components. - After curing, there is no concern about pump-out, similar to sheets. - It has been confirmed that there is no increase in thermal resistance in high-temperature durability evaluation tests at 150°C. - Excellent repairability after curing. *For more details, please refer to the PDF document or feel free to contact us.

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The "Cosmo Thermal Grease SF Series" is a non-silicone thermal interface material that can be spread thinly down to several tens of micrometers, reducing thermal resistance. Since it does not use a silicone-based substrate, there is no concern about contact failure due to low molecular siloxanes. It is widely adopted and used in various fields, including computer CPUs, wireless base stations, office multifunction devices, car navigation systems, and home appliances. 【Features】 ■ Excellent conformability to application surfaces, demonstrating effective thermal conductivity ■ Soft and can be spread thinly, resulting in less stress on components ■ No silicone-based substrate used, eliminating concerns about contact failure due to low molecular siloxanes *For more details, please refer to the PDF materials or feel free to contact us.

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"TIM" is a functional material that fills the gap between the heating element and the heat dissipation components, promoting the cooling of the heating element by reducing contact thermal resistance. This document explains the comparison of thermal grease, gap fillers, and thermal sheets, as well as the characteristics of gap fillers based on their curing types. It also introduces Cosmolub's lineup of thermal materials. Please take a moment to read it. [Contents] ■ About TIM (Thermal Interface Materials) ■ Comparison results of surface temperatures using infrared cameras and thermocouples ■ What is a thermal gap filler? ■ Cosmolub's lineup of thermal materials *For more details, please refer to the PDF document or feel free to contact us.

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We compared the thermal performance of four media: Cosmo thermal gap filler, thermal grease (Cosmo SF series), commercially available thermal sheets, and no TIM. As a result of tests evaluating the ease of dissipating heat from heat-generating components within the case to the outside, two products of Cosmo Lub's thermal conductive paste exhibited excellent thermal dissipation characteristics. Furthermore, due to its viscosity, which makes it easy to apply to the mounting board, it is also extremely user-friendly. [Used TIM] - Gap filler "CGS3501" - Thermal grease "SF311" - Commercially available thermal sheet (4W/m·K) - No TIM *For more details, please refer to the related link page or feel free to contact us.

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