<Free Offer> From my position, having been involved in thermal design for many years, I would like to share my thoughts on thermal design that I have on a daily basis.
Written by Mr. Naoki Kunimine, President of Thermal Design Lab Inc. This is a column document reflecting on 45 years of involvement in thermal design, titled "A Collection of Thermal Design Stories." Due to the positive feedback from readers, we are distributing the 7th installment of the column. 【Content Summary (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the 7th installment, following the 5th and 6th installments, we will focus on the "printed circuit board," which is central to thermal design, and discuss specific countermeasures. ■ Thermal measures for the circuit board are carried out through "heat source dispersion" and "heat diffusion." ■ Heat source dispersion achieves the same effect as "improving the thermal conductivity of the circuit board." ■ Forming a heat dissipation pattern with copper foil to diffuse heat within the circuit board. *For more details, please refer to the PDF document or feel free to contact us.
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This document is intended for engineers involved in the thermal design of electronic devices. Please be sure to check out Columns 1 through 6 as well. *For more details, please refer to the PDF document or feel free to contact us.*
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Cosmo Oil Lubricants conducts integrated research, development, manufacturing, and sales of various products, primarily focusing on lubricants, within the Cosmo Energy Group. Additionally, we are putting significant effort into the development and sales of thermal interface materials, and our unique thermal interface products, which apply lubricant development technology, are already being used by many customers. We will respond to future market needs in lubricants and thermal interface materials while also pursuing new developments centered around lubricant technology.