Circuit board manufacturing - Company Ranking(15 companyies in total)
Last Updated： Aggregation Period:Jul 30, 2025〜Aug 26, 2025
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Manufacturing Capability Values】 ■ Production Boards: 1 to 48 LAYERS ■ Board Thickness: 0.10mm to 3.2mm ■ Minimum Line/Space: 0.075mm (3mil) ■ Minimum Hole Diameter: 0.10mm (4mil) ■ Aspect Ratio: 10:1 ■ Impedance: ±7.5% ■ BVH: Laser Drill ■ Surface Treatment: Electroless Gold Plating, Preflux, Electroless Tin Plating, PB Free Leveler *For more details, please download the PDF or feel free to contact us. | Communication equipment, sensors, UPS equipment, beauty-related devices, consumer products, automotive-related, electric bicycles, power supply sensors, and various other products. ★ Please feel free to contact us anytime for inquiries regarding printed circuit boards. ★ We do not accept prototypes (development products). We only accept boards that flow from prototyping to mass production. | ||
| 【Manufacturing Capability Values】 ■Production Boards: 1 to 48 LAYERS ■Board Thickness: 0.10mm to 3.2mm ■Minimum L/S: 0.075mm (3mil) ■Minimum Hole Diameter: 0.10mm (4mil) ■Aspect Ratio: 10:1 ■Impedance: ±7.5% ■BVH: Laser Drill ■Surface Treatment: Electroless Gold Plating, Preflux, Electroless Tin Plating, PB Free Leveler *For more details, please download the PDF or feel free to contact us. | Communication equipment, sensors, UPS equipment, beauty-related devices, consumer products, automotive-related, electric bicycles, power supply sensors, and various other products. ★ Please feel free to contact us anytime for inquiries regarding printed circuit boards. ★ We do not accept prototypes (development products). We accept boards that flow from prototype to mass production. | ||
| 【Manufacturing Capability Values】 ■ Production Boards: 1 to 48 LAYERS ■ Board Thickness: 0.10mm to 3.2mm ■ Minimum L/S: 0.075mm (3mil) ■ Minimum Hole Diameter: 0.10mm (4mil) ■ Aspect Ratio: 10:1 ■ Impedance: ±7.5% ■ BVH: Laser Drill ■ Surface Treatment: Electroless Gold Plating, Preflux, Electroless Tin Plating, PB Free Leveler *For more details, please download the PDF or feel free to contact us. | Communication equipment, sensors, UPS equipment, beauty-related devices, consumer products, automotive-related, electric bicycles, power supply sensors, and various other products. ★ Please feel free to contact us anytime for inquiries regarding printed circuit boards. ★ We do not accept prototypes (development products). We only accept boards that flow from prototype to mass production. | ||
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- Featured Products
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Manufacturing of stack build-up substrates (6-layer substrates, 8-layer substrates, 10-layer substrates)
- overview
- 【Manufacturing Capability Values】 ■ Production Boards: 1 to 48 LAYERS ■ Board Thickness: 0.10mm to 3.2mm ■ Minimum Line/Space: 0.075mm (3mil) ■ Minimum Hole Diameter: 0.10mm (4mil) ■ Aspect Ratio: 10:1 ■ Impedance: ±7.5% ■ BVH: Laser Drill ■ Surface Treatment: Electroless Gold Plating, Preflux, Electroless Tin Plating, PB Free Leveler *For more details, please download the PDF or feel free to contact us.
- Application/Performance example
- Communication equipment, sensors, UPS equipment, beauty-related devices, consumer products, automotive-related, electric bicycles, power supply sensors, and various other products. ★ Please feel free to contact us anytime for inquiries regarding printed circuit boards. ★ We do not accept prototypes (development products). We only accept boards that flow from prototyping to mass production.
6-layer 14-layer rigid-flex circuit board metal core (aluminum) board manufacturing
- overview
- 【Manufacturing Capability Values】 ■Production Boards: 1 to 48 LAYERS ■Board Thickness: 0.10mm to 3.2mm ■Minimum L/S: 0.075mm (3mil) ■Minimum Hole Diameter: 0.10mm (4mil) ■Aspect Ratio: 10:1 ■Impedance: ±7.5% ■BVH: Laser Drill ■Surface Treatment: Electroless Gold Plating, Preflux, Electroless Tin Plating, PB Free Leveler *For more details, please download the PDF or feel free to contact us.
- Application/Performance example
- Communication equipment, sensors, UPS equipment, beauty-related devices, consumer products, automotive-related, electric bicycles, power supply sensors, and various other products. ★ Please feel free to contact us anytime for inquiries regarding printed circuit boards. ★ We do not accept prototypes (development products). We accept boards that flow from prototype to mass production.
Manufacturing of printed circuit boards COB boards (electroless gold plating and electroplated gold plating)
- overview
- 【Manufacturing Capability Values】 ■ Production Boards: 1 to 48 LAYERS ■ Board Thickness: 0.10mm to 3.2mm ■ Minimum L/S: 0.075mm (3mil) ■ Minimum Hole Diameter: 0.10mm (4mil) ■ Aspect Ratio: 10:1 ■ Impedance: ±7.5% ■ BVH: Laser Drill ■ Surface Treatment: Electroless Gold Plating, Preflux, Electroless Tin Plating, PB Free Leveler *For more details, please download the PDF or feel free to contact us.
- Application/Performance example
- Communication equipment, sensors, UPS equipment, beauty-related devices, consumer products, automotive-related, electric bicycles, power supply sensors, and various other products. ★ Please feel free to contact us anytime for inquiries regarding printed circuit boards. ★ We do not accept prototypes (development products). We only accept boards that flow from prototype to mass production.
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